SW-4-1-2: Lean Robotic Micromanufacturing

Prof. Dan Popa, University of Texas, Arlington, USA

Abstract

This research aims to create a systematic approach to micromanufacturing that guarantees high yield as well as reliable operation for the resulting microsystems. During the last decade, we have abstracted a micromanufacturing methodology combining design for automated assembly, design for reliability, and advanced assembly and packaging processes at the micro scale. Parts of the methodology have been demonstrated in manufacturing of microsystems such as S&a;A fuze packaging and a gas chemical sensor. In past work, two microrobotic systems, the “M3” and the “μ3”, have been configured to carry out microassembly tasks with MEMS parts between 10μm and 1mm in size.

We used these systems to abstract the concept of "Lean Robotic Micromanufacturing (LRM)" as a methodology that seeks to ensure 99%+ assembly yields. LRM includes workspace configuration rules, a quantitative assemblability criterion (High Yield Assembly Condition – H.Y.A.C.), and a Complexity Index (C.I.) for making yield maximization control and planning decisions. We also present results aimed at using LRM tools and methods to configure the next generation microrobotic systems at the wafer-scale - the "N3".

Speaker Biography

Dan Popa is presently an Associate Professor with the Electrical Engineering Department at The University of Texas at Arlington, and Head of the Next Generation Systems (NGS) research group. He received a BA in Engineering, Mathematics and Computer Science and a MS in Engineering, both from Dartmouth College where he was a Montgomery Scholar from 1990 to 1993. He received a PhD in Electrical Engineering from Rensselaer Polytechnic Institute (RPI) in 1998, focusing on control of nonholonomic systems and robots. He then joined the Center for Automation Technologies at RPI, where he held the rank of Senior Research Scientist until 2004. Between 2004 and 2010, Dr. Popa was an Assistant Professor with the Automation and Robotics Research Institute (ARRI) at UT Arlington, and a founding member of the Navy-funded Texas Microfactory Initiative. Dr. Popa has a broad experience base, including the modeling, simulation and control of microsystems, the design of multiscale assembly architectures, the control and deployment of microrobots, the development of new systems level processes for hermetic sealing, wafer bonding, and 3D wafer integration. Dr. Popa is the recipient of several prestigious awards as a member of IEEE, ASME and the author of over 100 refereed publications. He also serves as associate editor for the IEEE Transaction on Automation Science and Engineering (T-ASE), and is an active member in the IEEE Robotics and Automation Society (RAS) Committee on Micro-Nano Robotics, the ASME Committee on Micro-Nano Systems (MNS), and the IEEE NTC Technical Committee on Nano Energy, Environment, and Safety.

Presentation