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How to Become a User
Important Links
User Policies
Internal User Application
External User Application
User Fees Schedules
NanoFab Printable Brochure
SEM-FIB-Ebeam Writer Application
Equipment Contacts
Equipment Reservation and Status
Nano-MEMS Ph.D. Diagnostic Exam Information
 
TRION Deep Reactive Ion Etching (DRIE) System

Deep Reactive Ion Etching System for MEMS and NEMS research.
Substrate size: 4” diameter or smaller
Electrostatic chuck with backside helium cooling

TRION Deep Reactive Ion Etcher
All Etching-Ashing Facilities
• Diener Electronics Asher
• PlasmaQuest Plasma Etcher
• Supercritical Point Dryer
• Technics Micro-RIE Series 800 Plasma System
• TRION Deep Reactive Ion Etching (DRIE) System
• TRION MINILOCK II RIE System
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