Ph.D. Mechanical Engineering, Stanford University (2007)
M.S. Mechanical Engineering, Stanford University (2003)
B.Tech. Mechanical Engineering, Indian Institute of Technology (IIT), Delhi, India (2001)
Honors and Awards
2013 ASME Electronics & Photonics Packaging Division (EPPD) Young Engineer Award “for Outstanding Contributions as a Young Engineer to the Field of Electronic and Photonic Packaging Demonstrated through Papers, Patents, or Product Development”
AFOSR Summer Faculty Fellowship, 2013.
ONR Summer Faculty Fellowship, 2012.
Stanford Graduate Fellowship, 2001-2004.
Institute Silver Medal for highest GPA in the graduating class in the department of Mechanical Engineering at IIT, Delhi, 2001.
Summer Research Fellowship, Indian Institute of Science (IISc), Bangalore, India, 2000.
Microscale thermal-fluid transport
Electrochemical conversion microsystems
Multiscale modeling of thermal management in microelectronics and MEMS
Department of Defense, DURIP (with D. Wetz), 2014.
Office of Naval Research, (with D. Wetz), 2013.
Office of Naval Research (SBIR) Phase I, (with D. Wetz), 2013.
Air Force Office of Sponsored Research (AFOSR) Summer Faculty Fellowship Program, 2013.
Indo-US Science and Technology Forum, (with H. Tyagi), 2013.
National Science Foundation, (with D. Agonafer), 2012.
Office of Navy Research (ONR) Summer Faculty Research Program, 2012.
UT Arlington Research Enhancement Grant, 2012.
Guest Editor, IEEE Transactions on Components, Packaging and Manufacturing Technologies, 2013-present.
Member, ASME HTD K-16 Committee on Heat Transfer in Electronic Equipment, ASME BED/HTD K-17 Committee on Heat and Mass Transfer in Biotechnology, and ASME Electrochemical Energy Conversion and Storage technical committee.
Co-Organizer, Indo-US Workshop on Micro/Nanoscale Thermal Transport, Dec. 2013.
Invited speaker at a number of international conferences and workshops.
Proposal reviewer for multiple federal agencies.
Reviewer of manuscript for several leading journals and international conferences.
Track Co-Chair, ‘Micro and Nano Systems Engineering and Packaging’, ASME IMECE, Montreal, 2014.
Session chair at several international conferences, including ASME IMECE, IEEE ITherm, ASME InterPACK since 2007.