Published Final Programs 4590, BioMEMS and Smart Nanostructures 4591, Electronics and Structures for MEMS 4592, Device and Process Technologies for MEMS and Microelectronics 4593, Design, Characterization, and Packaging for MEMS and Microelectronics

SPIE 2001 International Symposium on Microelectronics and Micro-Electro-Mechanical Systems

Proceedings of SPIE Volume: 4592, Device and Process Technologies for MEMS and Microelectronics II ISBN 0-8194-4322-0

17-19 December 2001, Adelaide, Australia 2001 Symposium Chairs: Derek Abbott, Adelaide Univ. (Australia) Vijay K. Varadan, The Pennsylvania State Univ. (USA)

Location: Stramford Plaza Adelaide, 150 North Terrace, Adelaide

SPIE Conference 4592

Device and Process Technologies for MEMS and Microelectronics, II

Conference Chair: Jung-Chih Chiao, Chorum Technologies and Univ. of Hawaii/Manoa (USA)

Cochairs: Lorenzo Faraone, Univ. of Western Australia (Australia); H. Barry Harrison, Griffith University (Australia); Andrei M. Shkel, Univ. of California/Irvine (USA)

Introduction: This conference covers MEMS, optical MEMS, RF MEMS, and microelectronics at the device and process technology level. Scope: Materials: MEMS and nanomachining materials, smart materials, material processing, material issues. Process: Process technologies for MEMS devices and components, micro/nanomachining fabrication techniques, etching and deposition technologies, LIGA technologies, advanced fabrication techniques, nanomachining techniques. Devices: MOEMS and RF MEMS devices, actuators, sensors, micro-components. Systems: Advanced technologies and applications -- optical, RF and sensors, applications for micro-/nano-technologies, integrated devices and applications, impact of device and processing technologies on applications and system levels. Reliability: impact of material, processing techniques, and device technologies on reliability issues.

Invited Speakers: Masayoshi Esashi, Tohoku Univ. (Japan); Olga Boric-Lubecke, Lucent Technologies/Bell Labs. (USA) Jean-Phillippe Gouy, LIMMS/CNRS-IIS (France) and Univ. of Tokyo (Japan) Kazuhiro Hane, Tohoku University (Japan) Lih-Yuan Lin, Tellium, Inc. (USA) Victor Lubecke, Lucent Technologies/Bell Labs. (USA) Chantal Khan Malek, CNRS (France) Gabriel M. Rebeiz, Univ. of Michigan (USA) Kazuo Sato, Nagoya Univ. (Japan) Vijay K. Varadan, Pennsylvania State University (USA) Harri Kopola, VTT Electronics (Finland) Wolfgang Benecke, University of Bremen (Germany) Ci Moo Song, SAIT (Korea)

Program Committee:

J. Allen Cox, Honeywell Technology Ctr. (USA);
Masayoshi Esashi, Tohoku Univ. (Japan);
Joseph Ford, Optical Micro Machines (USA);
Hiroyuki Fujita, Univ. of Tokyo (Japan);
Muralidhar K. Ghantasala, Swinburne Univ. of Technology (Australia);
Jean-Phillippe Gouy, LIMMS/CNRS-IIS (France) and Univ. of Tokyo (Japan);
Jerome F. Jakubczak, Sandia National Labs. (USA);
Eun Sok Kim, Univ.of Southern California (USA) ;
David Harwell, Univ. of Hawaii (USA);
Klas Hjort, Uppsala Univ. (Sweden);
Yang-Tung Huang, National Chiao Tung Univ. (Taiwan);
Meng-Hsiung Kiang, Onix Microsystems, Inc. (USA);
Harri K. Kopola, VTT Electronics (Finland);
Youngwoo Kwon, Seoul Univ. (Korea);
C. K. Lee, National Taiwan Univ. (Taiwan);
Lih-Yuan Lin, Tellium, Inc. (USA);
Michael J. Little, Solus Micro Technologies, Inc. (USA);
Victor Lubecke, Lucent Technologies/Bell Labs. (USA);
Karen Marcus, JDS Uniphase (USA);
Koji Mizuno, Tohoku Univ. (Japan); Sangineni Mohan, Indian Institute of Science (India);
Ash M. Parameswaran, Simon Fraser Univ. (Canada);
Gabriel M. Rebeiz, Univ. of Michigan/Ann Arbor (USA);
Nico F. de Rooij, Univ. de Neuchâtel (Switzerland);
Dinesh K. Sood, Royal Melbourne Institute of Technology (Australia);
Vijay K. Varadan, The Pennsylvania State Univ. (USA);
Steve J. Walker, Integrated Micromachines Inc. (USA);
Roland Zengerle, Albert-Ludwigs University Freiburg (Germany)

Agenda - Final Program

Monday 17 December

Official Opening 8.15 to 9.10, Room: Terrace Ballroom

Monday Plenary Speakers 9.10 to 11.00

9.10 Novel Nano-organisms (Nanobes): Living Analogues for Martian "Nanobacteria"?, Philippa Uwins, Univ. of Queensland (Australia) [4590-01]

Coffee Break 9.50 to 10.10

10.10 Motility of Nanobes: Wider Perspective with Possible Technological Applications, Richard B. Hoover, NASA Marshall Space Flight Ctr. (USA) [4590-02]

SESSION 1, Room: Crystal Mon.11.10

Nanofabrication

11.10 Microstereo lithography and fabrication of 3D MEMS (Invited Paper), V. K. Varadan, V. V. Varadan, The Pennsylvania State Univ. (USA) [4592-01]

11.40 Stereochemistry of carbon nanotubes for electronic applications, M. A. Wilson, C. Marshall, Univ. of Technology/Sydney (Australia) [4592-02]

12.00 Smart dielectrics of fluorinated silicon glass prepared by liquid phase deposition method, C. F. Yeh, Y. C. Lee, National Chiao Tung Univ. (Taiwan) [4592-04]

12.20: Single-crystal silicon nanostructure fabrication by scanning probe lithography and anisotropic wet etching, K. M. Chang, K. S. You, National Chiao Tung Univ. (Taiwan); C. H. Wu, J. T. Sheu, Synchrotron Radiation Research Ctr. (Taiwan) [4592-03]

Lunch Break 12.40 to 14.00

SESSION 2, Room: Crystal Mon. 14.00

Materials

14.00 MEMS materials characterization necessary for smart design and fabrication (Invited Paper), K. Sato, Nagoya Univ. (Japan) [4592-05]

14.30 Micromachining of TiNi shape memory alloy by excimer laser ablation and etching, S. T. Davies, Univ. of Warwick (UK); E. C. Harvey, H. Jin, J. P. Hayes, M. K. Ghantasala, Swinburne Univ. of Technology (Australia) [4592-09]

14.50 Fabrication of mechanical structures using macro-porous silicon, P. J. French, Delft Univ. of Technology (Netherlands); H. Ohji, S. Izuo, K. Tsutsumi, Mitsubishi Electric Corp. (Japan) [4592-10]

15.10 Simple wet etching of GaN, G. Parish, P. A. Scali, B. D. Nener, Univ. of Western Australia (Australia) [4592-11]

Tuesday 18 December

Plenary Presentation 8:30 to 9:10 , Room: Terrace Ballroom

08.30 Biomimetic Visual Detection Based on Insect Neurobiology, David C. O'Carroll, Univ. of Washington (USA) and Adelaide Univ. (Australia) [4590-01]

SESSION 3, Room: Crystal Tues. 09.10

Fabrication Techniques

09.10 Fabrication of high-aspect-ratio precision MEMS with LIGA using synchrotron radiation (Invited Paper), C. G. Khan Malek, Univ. Paris-Sud (France) [4592-13]

09.40 Development of a systematic recipe set for processing SU8-5 photoresist, Y. C. Lo, Synchrotron Radiation Research Ctr. (Taiwan); D. H. Hwang, K. Chin, National Chiao Tung Univ. (Taiwan) [4592-14]

10.00 Fabrication of refractive and diffractive plastic microoptical components using microcompression molding, S. Kang, S. D. Moon, S. Ahn, Yonsei Univ. (Korea) [4592-15]

Refreshment Break 10.20 to 10.50

10.50 MEMS sensor packaging using LTCC substrate technology (Invited Paper), H. K. Kopola, J. Lenkkeri, T. Jaakola, VTT Electronics (Finland) [4592-16]

11.20 Surface micromachining of uncooled infrared imaging array using anisotropic conductive film, W. Liu, L. Sun, W. Zhu, O. K. Tan, Nanyang Technological Univ. (Singapore) [4592-17]

11.40 Laser-LIGA for microheaters, H. Jin, J. P. Hayes, M. K. Ghantasala, A. Dowling, E. C. Harvey, Swinburne Univ. of Technology (Australia) [4592-18]

12.00: µEDM produced mechanical grippers for handling and assembly in microtechnology, D. Petrovic, G. Popovic, Technische Univ. Wien (Austria); E. Chatzitheodoridis, AT&S AG (Austria); A. Almansa, H. Detter, Technische Univ. Wien (Austria); O. Del Medico, INOCON Technologie GmbH (Austria) [4592-19]

Lunch Break 12.20 to 14.00

SESSION 4, Room: Crystal Tues. 14.00

RF and Optical Applications

14.00 Methods for improving interconnect characteristics of thin film MEMS processes, B. E. Duewer, J. M. Wilson, A. E. Oberhofer, J. Muth, P. D. Franzon, North Carolina State Univ. (USA) [4592-21]

14.20 Electromagnetic remote control and down scaling advantages and examples for MOEMS, G. Reyne, L. Houlet, Y. Takahashi, T. Bourouina, H. Fujita, Univ. of Tokyo (Japan) [4592-22]

14.40 Intelligent star tracker, N. Clark, Air Force Research Lab. (USA) [4592-24]

Refreshment Break 15.00 to 15.30

15.30 Fabrication of a three-dimensional inductor coil using excimer laser micromachining, K. Jolic, M. K. Ghantasala, J. P. Hayes, R. Hobbs, E. C. Harvey, Swinburne Univ. of Technology (Australia) [4592-25]

15.50 Micro displacement sensing system and its application to micro magnetic bearings, L. Qin, R. B. Zmood, P. E. Jones, D. K. Sood, Royal Melbourne Institute of Technology (Australia) [4592-26]

16.10 pmMultistimuli integrated sensor development involving alternate materials, S. Rajic, Oak Ridge National Lab. (USA); P. G. Datskos, Univ. of Tennessee (USA) [4592-27]

Posters -Tuesday

Posters will be displayed in the Prefunction Area. Poster authors may set up their posters from 10.00 on for allday previewing. Poster presenters will stand by their posters from 17.30 to 19.00 to answer questions. Posters must be removed at the end of the poster session.

• Sub-micron high aspect ratio silicon beam etch, G. O'Brien, K. Najafi, Univ. of Michigan (USA) [4592-44]
• Materials and reliability issues in MEMS and microsystems, A. Christou, Univ. of Maryland/College Park (USA) [4592-45]
• Study of Cu/Ta and Ta/Cu diffusion for Si technology, S. W. Loh, D. H. Zhang, Nanyang Technological Univ. (Singapore); C. Y. Li, Institute of Microelectronics (Singapore); R. Liu, A. T. S. Wee, National Univ. of Singapore [4592-46]
• Thick resist for MEMS processing, J. Brown, C. Hamel, Karl Suss America Inc. (USA) [4592-47]
• Fabrication of integrated micromachined polymer magnet, O. Rojanapornpun, C. Y. Kwok, Univ. of New South Wales (Australia) [4592-48]
• Anodic aluminum oxide as a material for MEMS, O. Voitik, K. I. Delendik, Institute of Electronics (Belarus) [4592-49]
• Two-way shape memory thin film, E. Wibowo, C. Y. Kwok, Univ. of New South Wales (Australia) [4592-50]
• Investigation on processing compatibility of ZnO piezoelectric film with MEMS device, T. Xu, G. P. Li, M. Bachman, Univ. of California/Irvine (USA) [4592-51]
• Fabrication of 3D conical horn shape MEMS antenna array using columnar illuminator with an ultra-slow-rotated and inclined x-y-z stage, J. Y. Park, K. Kim, S. Moon, J. J. Park, Korea Institute of Science and Technology (Korea) [4592-52]
• Improvement of detectivity of bolometer by coupling conical horn antenna, K. Kim, J. Y. Park, S. Moon, J. J. Park, M. W. Oh, Korea Institute of Science and Technology (Korea) [4592-53]
• Study on porous silicon as a sacrificial layer used in RF-MEMS, P. Cong, Y. X. Liu, Y. Ding, T. L. Ren, L. T. Liu, Tsinghua Univ. (China) [4592-54]
• Micromachined tunable (Mi-T) VCSEL around 1300 nm, A. Benmoussa, J. Tatebayashi, J. P. Gouy, H. Fujita, Y. Arakawa, Univ. of Tokyo (Japan) [4592-55]
• LIGA fabrication of high aspect ratio Lobster-eye optics, A. G. Peele, T. H. K. Irving, K. A. Nugent, Univ. of Melbourne (Australia); D. C. Mancini, N. A. Moldovan, Argonne National Lab. (USA); T. R. Christenson, Sandia National Labs. (USA) [4592-56]
• Optical switch array based on microforming process, Y. Hashiura, T. Ikehara, A. Kitajima, National Institute of Advanced Industrial Science and Technology (Japan); H. Goto, Hitachi, Ltd. (Japan); R. Maeda, National Institute of Advanced Industrial Science and Technology (Japan) [4592-57]
• Copper micro-coil arrays for the actuation of optical matrix micro-switches, L. Houlet, G. Reyne, T. Iizuka, T. Bourouina, H. Fujita, Univ. of Tokyo (Japan) [4592-58]
• Bonding technologies for silicon scanning mirror having vertical comb fingers, J. H. Lee, Y. C. Ko, B. S. Choi, J. M. Kim, Samsung Advanced Institute of Technology (Korea); D. Y. Jeon, Korea Advanced Institute of Science and Technology (Korea) [4592-59]
• Novel accelerometer on (111) substrate with differential electrode, H. H. Hu, W. Fang, National Tsing Hua Univ. (Taiwan) [4592-60]
• MEMS-based precision motion control approach to high-throughput-rate electron-beam lithography, B. W. Smith, J. G. Chase, Univ. of Canterbury (New Zealand) [4592-62]
• Fabrication of a novel micromachined temperature distribution measurement system for analysis of flow characteristics in the microchannel, H. Park, Korea Univ. and Samsung Advanced Institute of Technology (Korea); G. B. Lim, I. S. Song, S. Y. Son, Samsung Advanced Institute of Technology (Korea); J. J. Park, Korea Univ. (Korea) [4592-63]
• Low-frequency process for silicon-on-insulator deep reactive ion etching, M. Wasilik, A. P. Pisano, Univ. of California/Berkeley (USA) [4592-64]
• Design and fabrication of a movable O-shape microclamper, C. T. Wu, W. Hsu, National Chiao Tung Univ. (Taiwan) [4592-68]
• Sidewall roughness control in advanced silicon etch process, H. C. Liu, National Chiao Tung Univ. (Taiwan); Y. H. Lin, B. C. S. Chou, Y. Y. Hsu, National Science Council (Taiwan); W. Hsu, National Chiao Tung Univ. (Taiwan) [4592-69]

Wednesday 19 December

Plenary Presentation 8:30 to 9:10 , Room: Terrace Ballroom

8.30 Micro-nanosystems by bulk silicon micromachining, M. Esashi, Tohoku Univ. (Japan) [4593-28]

SESSION 5, Room: Crystal Wed. 09.10

Systems and Characterization

9.10 Microsystem tool for microsystems characterization, J. B. Pourciel, E. Lebrasseur, T. Bourouina, T. Masuzawa, H. Fujita, Univ. of Tokyo (Japan) [4592-30]

9.30 Three terminal test structure to measure stiction force using I-V data, E. Bhattacharya, Indian Institute of Technology/Madras (India); J. Kuang, M. Judy, J. Martin, Analog Devices, Inc. (USA) [4592-31]

9.50 Thin silicon diaphragm formation by micromachining of (100) silicon for micro-electro-mechanical sensors, V. K. Dwivedi, Central Electronics Engineering Research Institute (India); R. Gopal, Univ. of Allahabad (India); M. Kumar, S. Ahmad, Central Electronics Engineering Research Institute (India) [4592-34]

10.10 Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and vacuum metal casting, Y. Murakoshi, K. Hanadaa, National Institute of Advanced Industrial Science and Technology (Japan); Y. Li, Tokyo Cathode Lab. (Japan); K. Uchino, TOSEI Electro Beam Ltd. (Japan); R. Maeda, National Institute of Advanced Industrial Science and Technology (Japan) [4592-65]

Refreshment Break 10.30 to 10.50

SESSION 6, Room: Crystal Wed. 10.50

Materials and Fabrication Techniques

10.50 Single-crystal silicon MEMS microactuator for high-density hard disk drive, J. Mou, S. Chen, Y. Lu, National Univ. of Singapore [4592-61]

11.10 Comparison between excimer laser patterning and wet etching of TiN thin films on metal sacrificial layers, A. Dowling, M. K. Ghantasala, J. P. Hayes, E. C. Harvey, D. Doyle, A. Vlasveld, Swinburne Univ. of Technology (Australia) [4592-66]

11.30 Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA, H. Jin, Swinburne Univ. of Technology (Australia); S. T. Davies, Univ. of Warwick (UK); J. P. Hayes, M. K. Ghantasala, E. C. Harvey, Swinburne Univ. of Technology (Australia) [4592-67]

11.50 Micro-fabrication of hemispherical poly-silicon shells standing on hemispherical cavities, C. H. Lin, National Chiao-Tung Univ. (Taiwan); Y. C. Lo, Synchrotron Radiation Research Ctr. (Taiwan); W. Hsu, National Chiao Tung Univ. (Taiwan) [4592-70]

Lunch Break 12.20 to 14.00

SESSION 7, Room: Crystal Wed. 14.00

Optical Applications

14.00 MEMS for optical networking: vast promises amid vaster promises (Invited Paper), L. Y. Lin, E. L. Goldstein, Tellium, Inc. (USA) [4592-36]

14.30 Si-micromachining for optics: optical components and sensors (Invited Paper), K. Hane, Tohoku Univ. (Japan) [4592-37]

Refreshment Break 15.00 to 15.30

15.30 Integration of active materials with silicon micromachining: applications to optical MEMS (Invited Paper), J. P. Gouy, Y. Arakawa, H. Fujita, Univ. of Tokyo (Japan) [4592-38]

16.00 Design, fabrication, and assembly studies of AlGaAs/GaAs optical MEMS structures, J. A. Lott, Air Force Institute of Technology (USA) [4592-39]

16.20 Antiresonant reflecting optical waveguide surface plasmon resonance sensors, Y. T. Huang, Y. Y. Kuo, W. Z. Chang, C. H. Chen, J. C. Chen, National Chiao Tung Univ. (Taiwan) [4592-40]

16.40 Novel micro all-optical and optoelecronic systems for optical cross-connect, M. A. Habli, United Arab Emirates Univ. (United Arab Emirates) [4592-41]

17.00 High-sensitivity MEMS microcantilever bimorph infrared imaging array, S. R. Hunter, Sarcon Microsystems, Inc. (USA); R. Amantea, L. A. Goodman, S. N. Perna, F. P. Pantuso, Sarnoff Corp. (USA) [4592-42]

17.20 One-dimensional and two-dimensional scanning mirrors using thermal buckle-beam actuation, M. Sinclair, Microsoft Corp. (USA) [4592-43]

Proceedings

SPIE Proceedings Vol. 4592

Device and Process Technologies for MEMS and Microelectronics II

Editor(s): Jung-Chih Chiao, Univ. of Hawaii/Manoa, Richardson, TX, USA.

ISBN: 0-8194-4322-0, 550 pages Published 2001 Meeting Date: 12/17 - 12/19/01, Adelaide, Australia

Abstracts for the papers in this volume are located in this file immediately following the contents list below. All papers are published by SPIE--The International Society for Optical Engineering, P.O. Box 10, Bellingham, Washington, 98227-0010, USA.

Ordering Information: Please contact SPIE: Telephone: (+1) 360/676-3290, Fax: (+1) 360/647-1445, E-mail: bookorders@spie.org

Introduction Contents * Micronanosystems by bulk silicon micromachining (Paper #: 4592-28) * Micro stereo lithography and fabrication of 3D MEMS and their applications (Paper #: 4592-01) * Stereochemistry of carbon nanotubes for electronic applications (Paper #: 4592-02) * Single-crystal silicon nanostructure fabrication by scanning probe lithography and anisotropic wet etching (Paper #: 4592-03) * Smart dielectrics of fluorinated silicon glass prepared by liquid phase deposition method (Paper #: 4592-04) * MEMS materials characterization necessary for smart design and fabrication (Paper #: 4592-05) * III-V-semiconductor-based MOEMS devices for optical telecommunications (Paper #: 4592-06) * MEMS applications of porous silicon (Paper #: 4592-07) * Micromachining of TiNi shape memory alloy by excimer laser ablation (Paper #: 4592-09) * Fabrication of mechanical structures using macroporous silicon (Paper #: 4592-10) * Simple wet etching of GaN (Paper #: 4592-11) * Shape memory alloy actuators and their reliability (Paper #: 4592-12) * Fabrication of high-aspect-ratio precision MEMS with LIGA using synchrotron radiation (Paper #: 4592-13) * Development of a systematic recipe set for processing SU8-5 photoresist (Paper #: 4592-14) * Fabrication of refractive and diffractive plastic micro-optical components using microcompression molding (Paper #: 4592-15) * MEMS sensor packaging using LTCC substrate technology (Paper #: 4592-16) * Surface micromachining of uncooled infrared imaging array using anisotropic conductive film (Paper #: 4592-17) * Laser LIGA for serpentine Ni microstructures (Paper #: 4592-18) * uEDM-produced mechanical grippers for handling and assembly in microtechnology (Paper #: 4592-19) * RFIC's challenges for third-generation wireless systems (Paper #: 4592-20) * Improving interconnect characteristics of thin film MEMS processes (Paper #: 4592-21) * Electromagnetic remote control and downscaling advantages and examples for MOEMS (Paper #: 4592-22) * Intelligent star tracker (Paper #: 4592-24) * Micro displacement sensing system and its application to micro magnetic bearings (Paper #: 4592-26) * Multiparameter integrated sensor development involving alternate materials (Paper #: 4592-27) * Microsystem tool for microsystem characterization profile measurement of high-aspect-ratio microstructures (Paper #: 4592-30) * Three-terminal test structure to measure stiction force using I-V data (Paper #: 4592-31) * Enabling MEMS technologies for communications systems (Paper #: 4592-32) * PZT stack etch for MEMS devices in a capacitively coupled high-density plasma reactor (Paper #: 4592-35) * MEMS for optical networking: vast promises amid vaster promises (Paper #: 4592-36) * Si micromachining for optics: optical components and sensors (Paper #: 4592-37) * Integration of active materials with silicon micromachining: applications to optical MEMS (Paper #: 4592-38) * Antiresonant reflecting optical waveguide surface plasmon resonance sensors (Paper #: 4592-40) * 1D and 2D scanning mirrors using thermal buckle-beam actuation (Paper #: 4592-43) * Submicron high-aspect-ratio silicon beam etch (Paper #: 4592-44) * Materials and reliability issues in MEMS and microsystems (Paper #: 4592-45) * Thick resist for MEMS processing (Paper #: 4592-47) * Fabrication of integrated micromachined polymer magnet (Paper#: 4592-48) * Anodic alumina as a material for MEMS (Paper #: 4592-49) * Two-way shape memory NiTi sputter-deposited film fabrication (Paper #: 4592-50) * Processing compatibility of ZnO piezoelectric film with MEMS device (Paper #: 4592-51) * Fabrication method of 3D feed horn shape MEMS antenna array using MRPBI system and application for microbolometer (Paper #: 4592-52) * Enhanced performance of microbolometer using coupled feed horn antenna (Paper #: 4592-53) * Porous silicon as a sacrificial layer used in rf MEMS (Paper #: 4592-54) * Micro-machined tunable (Mi-T) VCSEL around 1.3 um (Paper #: 4592-55) * LIGA fabrication of high-aspect-ratio lobster-eye optics (Paper #: 4592-56) * Optical switch array based on microforming process (Paper #: 4592-57) * Copper microcoil arrays for the actuation of optical matrix microswitches (Paper #: 4592-58) * Bonding technologies for silicon scanning mirror having vertical comb fingers (Paper #: 4592-59) * Novel accelerometer on (111) substrate with differential electrode (Paper #: 4592-60) * Single-crystal silicon MEMS microactuator for high-density hard disk drive (Paper #: 4592-61) * MEMS-based precision motion control approach to high-throughput-rate electron beam lithography (Paper #: 4592-62) * Low-frequency process for silicon-on-insulator deep reactive ion etching (Paper #: 4592-64) * Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and vacuum metal casting (Paper #: 4592-65) * Excimer laser patterning of TiN film from metal sacrificial layers (Paper #: 4592-66) * Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA (Paper #: 4592-67) * Design and fabrication of a movable O-shape microclamper (Paper #: 4592-68) * Parameters study to improve sidewall roughness in advanced silicon etch process (Paper #: 4592-69) * Microfabrication of hemispherical polysilicon shells standing on hemispherical cavities (Paper #: 4592-70) * Microjoining research and development at CSIRO (Paper #: 4592-71)

Monday Evening Reception Location: Government House A reception for conference attendees will be held at Government House with host Marjorie Jackson-Nelson, AO MBE, Governor of South Australia.

Tuesday Evening Ayer's House Banquet Location: Historic Old Adelaide Gaol 18 Gaol Road Therbarton SA Conference attendees are invited to attend a dinner at the Old Adelaide Gaol, which was built in 1878. Until 1988, this gaol still housed convicts within its historic walls. It has since been acquired by the National Trust and restored as a prison and museum. Situated one kilometre from the city, it is one of the most unusual catering venues South Australia has to offer. Transportation will be provided.

Created by J.C. Chiao