Conference 4592

Room: Crystal · Monday-Wednesday 17-19 December 2001
Proceedings of SPIE Vol. #4592

Monday 17 December

Official Opening 8.15 to 9.10

Room: Terrace Ballroom

Monday Plenary Speakers 9.10 to 11.00

9.10 Novel Nano-organisms (Nanobes): Living Analogues for Martian "Nanobacteria"?, Philippa Uwins, Univ. of Queensland (Australia) [4590-01]

Coffee Break 9.50 to 10.10

10.10 Motility of Nanobes: Wider Perspective with Possible Technological Applications, Richard B. Hoover, NASA Marshall Space Flight Ctr. (USA) [4590-02]

SESSION 1

Room: Crystal Mon.11.10

Nanofabrication

11.10 Microstereo lithography and fabrication of 3D MEMS (Invited Paper), V. K. Varadan, V. V. Varadan, The Pennsylvania State Univ. (USA) [4592-01]

11.40 Stereochemistry of carbon nanotubes for electronic applications, M. A. Wilson, C. Marshall, Univ. of Technology/Sydney (Australia) [4592-02]

12.00: Single-crystal silicon nanostructure fabrication by scanning probe lithography and anisotropic wet etching, K. M. Chang, K. S. You, National Chiao Tung Univ. (Taiwan); C. H. Wu, J. T. Sheu, Synchrotron Radiation Research Ctr. (Taiwan) [4592-03]

12.20 Smart dielectrics of fluorinated silicon glass prepared by liquid phase deposition method, C. F. Yeh, Y. C. Lee, National Chiao Tung Univ. (Taiwan) [4592-04]

Lunch Break 12.40 to 14.00

SESSION 2

Room: Crystal Mon. 14.00

Materials

14.00 MEMS materials characterization necessary for smart design and fabrication (Invited Paper), K. Sato, Nagoya Univ. (Japan) [4592-05]

14.30 III-V semiconductor-based MOEMS devices for optical telecommunications (Invited Paper), P. Viktorovitch, J. L. Leclercq, M. Garrigues, Ecole Centrale de Lyon (France) [4592-06]

Refreshment Break 15.00 to 15.30

15.30 MEMS applications of porous silicon (Invited Paper), W. Benecke, A. Splinter, Univ. Bremen (Germany) [4592-07]

16.00 SmCo/sub5 magnetic thin films for MEMS applications, S. Mohan, R. Balu, Indian Institute of Science (India); R. Raju, Jawaharlal Nehru Ctr. for Advanced Research (India); L. Shivalingappa, Indian Institute of Science (India) [4592-08]

16.20 Micromachining of TiNi shape memory alloy by excimer laser ablation and etching, S. T. Davies, Univ. of Warwick (UK); E. C. Harvey, H. Jin, J. P. Hayes, M. K. Ghantasala, Swinburne Univ. of Technology (Australia) [4592-09]

16.40 Fabrication of mechanical structures using macro-porous silicon, P. J. French, Delft Univ. of Technology (Netherlands); H. Ohji, S. Izuo, K. Tsutsumi, Mitsubishi Electric Corp. (Japan) [4592-10]

17.00 Simple wet etching of GaN, G. Parish, P. A. Scali, B. D. Nener, Univ. of Western Australia (Australia) [4592-11]

17.20 Shape memory alloy actuators and their reliability, O. Tohyama, S. Maeda, K. Abe, M. Murayama, Mitsubishi Cable Industries, Ltd. (Japan) [4592-12]

Tuesday 18 December

Plenary Presentation 8:30 to 9:10

Room: Terrace Ballroom

Biomimetic Visual Detection Based on Insect Neurobiology, David C. O'Carroll, Univ. of Washington (USA) and Adelaide Univ. (Australia) [4590-01]

SESSION 3

Room: Crystal Tues. 09.10

Fabrication Techniques

09.10 Fabrication of high-aspect-ratio precision MEMS with LIGA using synchrotron radiation (Invited Paper), C. G. Khan Malek, Univ. Paris-Sud (France) [4592-13]

09.40 Development of a systematic recipe set for processing SU8-5 photoresist, Y. C. Lo, Synchrotron Radiation Research Ctr. (Taiwan); D. H. Hwang, K. Chin, National Chiao Tung Univ. (Taiwan) [4592-14]

10.00 Fabrication of refractive and diffractive plastic microoptical components using microcompression molding, S. Kang, S. D. Moon, S. Ahn, Yonsei Univ. (Korea) [4592-15]

Refreshment Break 10.20 to 10.50

10.50 MEMS sensor packaging using LTCC substrate technology (Invited Paper), H. K. Kopola, J. Lenkkeri, T. Jaakola, VTT Electronics (Finland) [4592-16]

11.20 Surface micromachining of uncooled infrared imaging array using anisotropic conductive film, W. Liu, L. Sun, W. Zhu, O. K. Tan, Nanyang Technological Univ. (Singapore) [4592-17]

11.40 Laser-LIGA for microheaters, H. Jin, J. P. Hayes, M. K. Ghantasala, A. Dowling, E. C. Harvey, Swinburne Univ. of Technology (Australia) [4592-18]

12.00: µEDM produced mechanical grippers for handling and assembly in microtechnology, D. Petrovic, G. Popovic, Technische Univ. Wien (Austria); E. Chatzitheodoridis, AT&S AG (Austria); A. Almansa, H. Detter, Technische Univ. Wien (Austria); O. Del Medico, INOCON Technologie GmbH (Austria) [4592-19]

Lunch Break 12.20 to 14.00

SESSION 4

Room: Crystal Tues. 14.00

RF and Optical Applications

14.00 RFIC's challenges for third-generation wireless systems (Invited Paper), O. Boric-Lubecke, J. Lin, P. Gould, Lucent Technologies/Bell Labs. (USA) [4592-20]

14.30 Methods for improving interconnect characteristics of thin film MEMS processes, B. E. Duewer, J. M. Wilson, A. E. Oberhofer, J. Muth, P. D. Franzon, North Carolina State Univ. (USA) [4592-21]

14.50 Electromagnetic remote control and down scaling advantages and examples for MOEMS, G. Reyne, L. Houlet, Y. Takahashi, T. Bourouina, H. Fujita, Univ. of Tokyo (Japan) [4592-22]

Refreshment Break 15.10 to 15.40

15.40 RF MEMS technology for the next-generation mobile phones (Invited Paper), C. M. Song, Samsung Advanced Institute of Technology (Korea) [4592-23]

16.10 Intelligent star tracker, N. Clark, Air Force Research Lab. (USA) [4592-24]

16.30 Fabrication of a three-dimensional inductor coil using excimer laser micromachining, K. Jolic, M. K. Ghantasala, J. P. Hayes, R. Hobbs, E. C. Harvey, Swinburne Univ. of Technology (Australia) [4592-25]

16.50 Micro displacement sensing system and its application to micro magnetic bearings, L. Qin, R. B. Zmood, P. E. Jones, D. K. Sood, Royal Melbourne Institute of Technology (Australia) [4592-26]

17.10 pmMultistimuli integrated sensor development involving alternate materials, S. Rajic, Oak Ridge National Lab. (USA); P. G. Datskos, Univ. of Tennessee (USA) [4592-27]

Posters -Tuesday

Posters will be displayed in the Prefunction Area. Poster authors may set up their posters from 10.00 on for allday previewing. Poster presenters will stand by their posters from 17.30 to 19.00 to answer questions. Posters must be removed at the end of the poster session.

• Sub-micron high aspect ratio silicon beam etch, G. O'Brien, K. Najafi, Univ. of Michigan (USA) [4592-44]
• Materials and reliability issues in MEMS and microsystems, A. Christou, Univ. of Maryland/College Park (USA) [4592-45]
• Study of Cu/Ta and Ta/Cu diffusion for Si technology, S. W. Loh, D. H. Zhang, Nanyang Technological Univ. (Singapore); C. Y. Li, Institute of Microelectronics (Singapore); R. Liu, A. T. S. Wee, National Univ. of Singapore [4592-46]
• Thick resist for MEMS processing, J. Brown, C. Hamel, Karl Suss America Inc. (USA) [4592-47]
• Fabrication of integrated micromachined polymer magnet, O. Rojanapornpun, C. Y. Kwok, Univ. of New South Wales (Australia) [4592-48]
• Anodic aluminum oxide as a material for MEMS, O. Voitik, K. I. Delendik, Institute of Electronics (Belarus) [4592-49]
• Two-way shape memory thin film, E. Wibowo, C. Y. Kwok, Univ. of New South Wales (Australia) [4592-50]
• Investigation on processing compatibility of ZnO piezoelectric film with MEMS device, T. Xu, G. P. Li, M. Bachman, Univ. of California/Irvine (USA) [4592-51]
• Fabrication of 3D conical horn shape MEMS antenna array using columnar illuminator with an ultra-slow-rotated and inclined x-y-z stage, J. Y. Park, K. Kim, S. Moon, J. J. Park, Korea Institute of Science and Technology (Korea) [4592-52]
• Improvement of detectivity of bolometer by coupling conical horn antenna, K. Kim, J. Y. Park, S. Moon, J. J. Park, M. W. Oh, Korea Institute of Science and Technology (Korea) [4592-53]
• Study on porous silicon as a sacrificial layer used in RF-MEMS, P. Cong, Y. X. Liu, Y. Ding, T. L. Ren, L. T. Liu, Tsinghua Univ. (China) [4592-54]
• Micromachined tunable (Mi-T) VCSEL around 1300 nm, A. Benmoussa, J. Tatebayashi, J. P. Gouy, H. Fujita, Y. Arakawa, Univ. of Tokyo (Japan) [4592-55]
• LIGA fabrication of high aspect ratio Lobster-eye optics, A. G. Peele, T. H. K. Irving, K. A. Nugent, Univ. of Melbourne (Australia); D. C. Mancini, N. A. Moldovan, Argonne National Lab. (USA); T. R. Christenson, Sandia National Labs. (USA) [4592-56]
• Optical switch array based on microforming process, Y. Hashiura, T. Ikehara, A. Kitajima, National Institute of Advanced Industrial Science and Technology (Japan); H. Goto, Hitachi, Ltd. (Japan); R. Maeda, National Institute of Advanced Industrial Science and Technology (Japan) [4592-57]
• Copper micro-coil arrays for the actuation of optical matrix micro-switches, L. Houlet, G. Reyne, T. Iizuka, T. Bourouina, H. Fujita, Univ. of Tokyo (Japan) [4592-58]
• Bonding technologies for silicon scanning mirror having vertical comb fingers, J. H. Lee, Y. C. Ko, B. S. Choi, J. M. Kim, Samsung Advanced Institute of Technology (Korea); D. Y. Jeon, Korea Advanced Institute of Science and Technology (Korea) [4592-59]
• Novel accelerometer on (111) substrate with differential electrode, H. H. Hu, W. Fang, National Tsing Hua Univ. (Taiwan) [4592-60]
• Single-crystal silicon MEMS microactuator for high-density hard disk drive, J. Mou, S. Chen, Y. Lu, National Univ. of Singapore [4592-61]
• MEMS-based precision motion control approach to high-throughput-rate electron-beam lithography, B. W. Smith, J. G. Chase, Univ. of Canterbury (New Zealand) [4592-62]
• Fabrication of a novel micromachined temperature distribution measurement system for analysis of flow characteristics in the microchannel, H. Park, Korea Univ. and Samsung Advanced Institute of Technology (Korea); G. B. Lim, I. S. Song, S. Y. Son, Samsung Advanced Institute of Technology (Korea); J. J. Park, Korea Univ. (Korea) [4592-63]
• Low-frequency process for silicon-on-insulator deep reactive ion etching, M. Wasilik, A. P. Pisano, Univ. of California/Berkeley (USA) [4592-64]
• Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and vacuum metal casting, Y. Murakoshi, K. Hanadaa, National Institute of Advanced Industrial Science and Technology (Japan); Y. Li, Tokyo Cathode Lab. (Japan); K. Uchino, TOSEI Electro Beam Ltd. (Japan); R. Maeda, National Institute of Advanced Industrial Science and Technology (Japan) [4592-65]
• Comparison between excimer laser patterning and wet etching of TiN thin films on metal sacrificial layers, A. Dowling, M. K. Ghantasala, J. P. Hayes, E. C. Harvey, D. Doyle, A. Vlasveld, Swinburne Univ. of Technology (Australia) [4592-66]
• Influence of patterning geometry on the electrodeposition of microstructures fabricated by laser LIGA, H. Jin, Swinburne Univ. of Technology (Australia); S. T. Davies, Univ. of Warwick (UK); J. P. Hayes, M. K. Ghantasala, E. C. Harvey, Swinburne Univ. of Technology (Australia) [4592-67]
• Design and fabrication of a movable O-shape microclamper, C. T. Wu, W. Hsu, National Chiao Tung Univ. (Taiwan) [4592-68]
• Sidewall roughness control in advanced silicon etch process, H. C. Liu, National Chiao Tung Univ. (Taiwan); Y. H. Lin, B. C. S. Chou, Y. Y. Hsu, National Science Council (Taiwan); W. Hsu, National Chiao Tung Univ. (Taiwan) [4592-69]
• Micro-fabrication of hemispherical poly-silicon shells standing on hemispherical cavities, C. H. Lin, National Chiao-Tung Univ. (Taiwan); Y. C. Lo, Synchrotron Radiation Research Ctr. (Taiwan); W. Hsu, National Chiao Tung Univ. (Taiwan) [4592-70]

Wednesday 19 December

Plenary Presentation 8:30 to 9:10

Room: Terrace Ballroom

8.30 Micro-nanosystems by bulk silicon micromachining, M. Esashi, Tohoku Univ. (Japan) [4593-28]

SESSION 5

Room: Crystal Wed. 09.10

Systems and Characterization

09.10 Recent developments in RF MEMS circuits (Invited Paper), G. M. Rebeiz, Univ. of Michigan (USA) [4592-29]

9.40 Microsystem tool for microsystems characterization, J. B. Pourciel, E. Lebrasseur, T. Bourouina, T. Masuzawa, H. Fujita, Univ. of Tokyo (Japan) [4592-30]

10.00 Three terminal test structure to measure stiction force using I-V data, E. Bhattacharya, Indian Institute of Technology/Madras (India); J. Kuang, M. Judy, J. Martin, Analog Devices, Inc. (USA) [4592-31]

Refreshment Break 10.20 to 10.50

10.50 Enabling MEMS technologies for communications systems (Invited Paper), V. M. Lubecke, Lucent Technologies/Bell Labs. (USA) [4592-32]

11.20 Development of compliant micro mechanisms, M. R. Kujath, T. Hubbard, Y. Lai, Dalhousie Univ. (Canada) [4592-33]

11.40: Thin silicon diaphragm formation by micromachining of (100) silicon for micro-electro-mechanical sensors, V. K. Dwivedi, Central Electronics Engineering Research Institute (India); R. Gopal, Univ. of Allahabad (India); M. Kumar, S. Ahmad, Central Electronics Engineering Research Institute (India) [4592-34]

12.00 PZT stack etch for MEMS devices in a capacitively coupled high-density plasma reactor, P. F. Werbaneth, J. Almerico, L. G. Jerde, S. Marks, Tegal Corp. (USA) [4592-35]

Lunch Break 12.20 to 14.00

SESSION 6

Room: Crystal Wed. 14.00

Optical Applications

14.00 MEMS for optical networking: vast promises amid vaster promises (Invited Paper), L. Y. Lin, E. L. Goldstein, Tellium, Inc. (USA) [4592-36]

14.30 Si-micromachining for optics: optical components and sensors (Invited Paper), K. Hane, Tohoku Univ. (Japan) [4592-37]

Refreshment Break 15.00 to 15.30

15.30 Integration of active materials with silicon micromachining: applications to optical MEMS (Invited Paper), J. P. Gouy, Y. Arakawa, H. Fujita, Univ. of Tokyo (Japan) [4592-38]

16.00 Design, fabrication, and assembly studies of AlGaAs/GaAs optical MEMS structures, J. A. Lott, Air Force Institute of Technology (USA) [4592-39]

16.20 Antiresonant reflecting optical waveguide surface plasmon resonance sensors, Y. T. Huang, Y. Y. Kuo, W. Z. Chang, C. H. Chen, J. C. Chen, National Chiao Tung Univ. (Taiwan) [4592-40]

16.40 Novel micro all-optical and optoelecronic systems for optical cross-connect, M. A. Habli, United Arab Emirates Univ. (United Arab Emirates) [4592-41]

17.00 High-sensitivity MEMS microcantilever bimorph infrared imaging array, S. R. Hunter, Sarcon Microsystems, Inc. (USA); R. Amantea, L. A. Goodman, S. N. Perna, F. P. Pantuso, Sarnoff Corp. (USA) [4592-42]

17.20 One-dimensional and two-dimensional scanning mirrors using thermal buckle-beam actuation, M. Sinclair, Microsoft Corp. (USA) [4592-43]

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