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Monday 19 May
SESSION
1 to run parallel with SESSION 2
SESSION 1 Mon. 10.15 to 12.55
MaterialsSOI-silicon as structural layer for NEMS applications, M. Villarroya, Univ. Autònoma de Barcelona (Spain); E. Figueras, F. Perez-Murano, F. Campabadal, J. Esteve, Ctr. Nacional de Microelectrónica (Spain); N. Barniol, Univ. Autònoma de Barcelona (Spain) [5116-01] Fabrication and characterization of multi-layered SOI for MEMS applications, K. Somasundram, D. Cole, C. McNamara, A. Boyle, P. McCann, C. Devine, A. Nevin, Analog Devices Belfast Ltd. (United Kingdom) [5116-02] Microstructuring of PYREX glass and polymers by excimer laser, B. Keiper, H. Exner, R. Ebert, U. Löschner, Laserinstitut Mittelsachsen e.V. (Germany) [5116-03] Stereolithography of lead zirconate titanate ceramics for MEMS applications, D. Olivier, H. Le Gall, S. Corbel, Groupe ENSIC-Nancy (France) [5116-04] Fabrication of micromachined TiNi based microgripper with complaint structure, Y. Fu, H. Du, Nanyang Technological Univ. (Singapore) [5116-05] Electroactive characteristics of hydrogels composed of poly(vinyl alcohol) and poly(N-isopropylacrylamide), S. J. Kim, S. J. Park, S. I. Kim, I. Y. Kim, Y. M. Lee, Hanyang Univ. (South Korea); H. C. Kim, Seoul National Univ. (South Korea); T. D. Chung, Sungshin Women's Univ. (South Korea) [5116-06] Surface microstructuring of biocompatible bone analogue material HAPEX using LIGA technique and embossing, A. Schneider, E. Huq, Rutherford Appleton Lab. (United Kingdom); S. Rea, W. Bonfield, Univ. of Cambridge (United Kingdom) [5116-07] Modified sol-gel derived PZT ceramics, A. M. Amer, Suez Univ. (Egypt) [5116-08] Lunch Break SESSION 2 Mon. 10.15 to 12.55
Sensors ISmart sensors development based on a distributed bus for microsystems applications, C. Ferrer, Ctr. Nacional de Microelectrónica (Spain) and Univ. Autònoma de Barcelona (Spain); B. Lorente, Univ. Autònoma de Barcelona (Spain) and Ctr. Nacional de Microelectrónica (Spain) [5116-09] Low-temperature InOx thin films for O3 and NO2 gas sensing, G. Kiriakidis, H. Ouacha, Foundation for Research and Technology (Greece) [5116-10] Design fabrication and test of micromachined silicon capacitive gas sensors with integrated read-out, J. Amírola-Sanz, A. Rodiguez, L. Castaner, Univ. Politècnica de Catalunya (Spain) [5116-11] Novel strain sensors based on magnetostrictive magnetic tunneling junctions, M. Loehndorf, CAESAR (Germany); J. Wecker, M. Rüehrig, Siemens AG (Germany); E. Quandt, CAESAR (Germany) [5116-12] Multimode torsional micro-oscillators and micromagnets for NMR force microscopy, J. T. Markert, Y. J. Lee, T. C. Messina, C. W. Miller, U. M. Mirsaidov, Univ. of Texas/ Austin (USA) [5116-13] Hybrid neural networks for ISFET source separation, S. Bermejo, G. Bedoya, J. Cabestany, Univ. Politècnica de Catalunya (Spain) [5116-14] Compatibility of gas and flow sensor technology fabrication, N. Sabate, I. Gràcia, C. Cane, Nacional de Microelectrónica (Spain); J. Puigcorbé, J. Cerdà, J. R. Morante, Univ. de Barcelona (Spain); J. Berganzo, IKERLAN (Spain) [5116-15] Pencil probe system for electrochemical analysis and modification in nanometer dimension, R. J. Fasching, Y. Tao, K. Hammerick, F. B. Prinz, Stanford Univ. (USA) [5116-16] Lunch Break SESSION
3 to run parallel with SESSION 4
SESSION 3 Mon. 14.15 to 17.20
MEMS IOverview of MEMS/NEMS technology development for space applications at NASA/JPL (Invited Paper), T. George, Jet Propulsion Lab. (USA) [5116-17] Adhesive wafer bonding for MEMS applications, V. Dragoi, T. Glinsner, G. Mittendorfer, EV Group E. Thallner GmbH (Austria); B. Wieder, EV Group Inc. (USA); P. Lindner, EV Group E. Thallner GmbH (Austria) [5116-18] Silicon nanolayer transfer, A. Usenko, Silicon Wafer Technologies (USA); W. Carr, New Jersey Institute of Technology (USA) [5116-19] Power consumption in microvalves design, T. Hsu, San Jose State Univ. (USA) and Univ. of Illinois (USA) [5116-20] Micromolding with surface engineered metallic inserts, W. J. Meng, Louisiana State Univ. (USA) [5116-21] High-performance polysilicon air-gap thin film transistor on low-temperature substrates, H. M. Kotb, A. Salaün, M. Tayeb, B. Olivier, Univ. de Rennes 1 (France) [5116-22] Soft lithographic patterning of oxide thin films, E. Abad, Tekniker (Spain) and Cranfield Univ. (United Kingdom); R. W. Whatmore, Q. Zhang, Z. Huang, Cranfield Univ. (United Kingdom) [5116-23] Observability, exact controllability, and stabilization of piezoelectric medium coupled to electronic systems, G. Senouci-Bereksi, Ctr. of Advanced European Studies and Research (Germany); A. Benchaib, Univ. de Mostaganem (Algeria) [5116-24] SESSION 4 Mon. 14.15 to 17.20
Actuators IOptical components and actuators for integrated near-field optical data storage (Invited Paper), K. Hane, Y. Kanamori, Tohoku Univ. (Japan) [5116-25] Integrated near-field optical head for hybrid recording, Y. Chiu, M. Wu, H. D. Shieh, Y. T. Sun, H. Chou, W. Hsu, National Chiao Tung Univ. (Taiwan) [5116-26] Optomechanical cycles of photochromic-polymer microsystems induced by laser irradiation, A. Athanassiou, M. Kalyva, K. Lakiotaki, C. Fotakis, Foundation for Research and Technology-Hellas (Greece) [5116-27] Classical holography and opto-digital holography applied to testing of microsystems: a comparative study, V. D. Petrov, Holographic Lab. (Germany) [5116-28] Smart tong grippers for micro parts, J. Schlick, D. Zuehlke, Univ. Kaiserslautern (Germany) [5116-29] Shell-type micromechanical oscillator, M. Zalalutdinov, K. Aubin, Cornell Univ. (USA); B. H. Houston, Naval Research Lab. (USA); A. T. Zehnder, B. Ilic, D. Czaplewski, H. G. Craighead, J. M. Parpia, Cornell Univ. (USA) [5116-30] Knitted strain gauges, R. Wijesiriwardana, T. Dias, S. Mukhopadhyay, Univ. of Manchester Institute of Science and Technology (United Kingdom) [5116-31] Analysis of a piezoelectric-driven hydraulic poppet valve, R. Nunez-Lopez, Univ. of Sheffield (United Kingdom); W. A. Bullough, Univ. of Sheffield (United Kingdom) and Journal of Intelligent Materials and Structures (USA) and Journal of Applied Mechanics and Engineering (United Kingdom); S. B. Chin, Univ. of Sheffield (United Kingdom) [5116-32] Tuesday 20 May
SESSION
5 to run parallel with SESSION 6
SESSION 5 Tues. 9.45 to 12.55
Actuators IIFolded and tapered-beam thermal actuator (Invited Paper), M. J. Sinclair, Microsoft Corp. (USA); K. Wang, Univ. of Washington (USA) [5116-33] Evaluation of mechanical properties of polysilicon by comb-finger actuation, R. Cambie, F. Carli, C. Combi, Univ. degli Studi di Pavia (Italy) [5116-34] Smart electrostrictive composite materials for actuators, N. Yu, Yuan-Ze Univ. (Taiwan) [5116-35] Electronic circuitry development in a micropyrotechnic system for micropropulsion applications, M. Puig-Vidal, J. Lopez-Sanchez, P. L. Miribel-Catala, E. Montane-Borras, J. M. Lopez-Villegas, J. Samitier-Marti, Univ. de Barcelona (Spain); C. Rossi, T. Camps, M. Dumonteuil, CNRS (France) [5116-36] Sigma-delta microsystems for readout and servo control, N. Delorme, C. Condemine, LETI-CEA (France); D. Barbier, INSA Lyon (France) [5116-37] Brass microfabricated pump with a built in magnetic driver, R. M. Atta, Univ. of Southampton (United Kingdom) [5116-38] Laser beam micro forming as a new adjustment technology using dedicated actuator structures, A. M. Olowinsky, L. Bosse, Fraunhofer-Institut für Lasertechnik (Germany) [5116-39] Design and fabrication of a three-dimensional long-stretch micro drive by electroplating, C. Wu, W. Tai, W. Hsu, National Chiao Tung Univ. (Taiwan) [5116-40] Modeling and simulation for electrostatically driven microactuator, T. Ha, O. Kwon, J. Kim, T. Won, Inha Univ. (South Korea) [5116-41] Lunch Break SESSION 6 Tues. 9.45 to 12.35
Sensors IIDevelopment of microbead size selection chip for a chemical array sensor (Invited Paper), D. Neikirk, B. H. Park, Y. S. Park, Univ. of Texas/Austin (USA) [5116-42] Polymeric mechanical sensors with piezoresistive readout integrated in a microfluidic system, M. Calleja, P. A. Rasmussen, A. Johansson, A. Boisen, Danmarks Tekniske Univ. (Denmark) [5116-43] Compact and smart laser diode systems for cancer treatment, V. N. Svirin, POLYUS Research and Development Institute (Russia); V. V. Sokolov, P.A. Hertzen Moscow Research Oncology Institute (Russia); T. I. Solovieva, POLYUS Research and Development Institute (Russia) [5116-44] Fluidics technology: a source of new possibilities for the new millennium, N. F. Macia, Arizona State Univ. (USA) [5116-45] Long periodic grating in multimode fiber for measuring traces of chromium in water, P. Suresh Kumar, C. P. Vallabhan, V. P. Nampoori, P. Radhakrishnan, Cochin Univ. of Science and Technology (India) [5116-46] Metallophthalocyanine blend polymeric films-based ammonia gas sensor, S. D. Chakane, R. D. Kankaria, BJS College Wagholi (India) [5116-47] Resonating cantilever mass sensor with on-plane excitation, J. Teva, G. Abadal, Univ. Autònoma de Barcelona (Spain); X. Jordà, Ctr. Nacional de Microelectrónica (Spain); N. Barniol, Univ. Autònoma de Barcelona (Spain) [5116-48] Simulation of bulk micromachined vibration sensor with low noise, J. Zhu, Southeast Univ. (China); X. Liu, M. Huo, W. Chen, Q. Chen, Harbin Institute of Technology (China) [5116-49] Lunch Break SESSION
7 to run parallel with SESSION 8
SESSION 7 Tues. 14.15 to 17.20
MEMS IINano-bending method to quantify the residual stress of MEMS structure (Invited Paper), J. Kim, J. Kim, Seoul National Univ. (South Korea); J. Hahn, Korea Research Institute of Standards and Science (South Korea); Y. Kim, Seoul National Univ. (South Korea) [5116-50] Laser bending of silicon microstructures, H. Exner, U. Löschner, Laserinstitut Mittelsachsen e.V. (Germany) [5116-51] Rapid prototyping and structure generation using three-dimensional nanolithography with electron beam induced chemical reactions, H. W. Koops, NaWoTec GmbH (Germany) [5116-52] Fabrication and characterization of nano-interdigitated electrodes, N. F. de Rooij, Univ. de Neuchatel (Switzerland) [5116-53] Dynamic characterization of SiO2-Au microcantilevers using Michelson interferometer, G. Marinier, Univ. de Rouen (France); S. Dilhaire, L. D. Patino Lopez, Univ. Bordeaux 1 (France); M. Benzohra, Univ. de Rouen (France) [5116-54] Experimental modal testing for microsystems, O. B. Ozdoganlar, B. D. Hansche, T. G. Carne, Sandia National Labs. (USA) [5116-55] Characterization of SU-8 as a photoresist for electron beam lithography, A. C. Nallani, S. W. Park, J. B. Lee, Univ. of Texas/Dallas (USA) [5116-56] Characterization of embedded root method in UV-LIGA process, C. Ho, W. Hsu, National Chiao Tung Univ. (Taiwan) [5116-57] SESSION 8 Tues. 14.15 to 17.30
Optical ApplicationsOptical MEMS devices for telecom systems (Invited Paper), F. Pardo, Lucent Technologies/Bell Labs. (USA) [5116-58] MEMS mirror array for a wavelength selective 1xN switch (Invited Paper), D. O. Lopez, Lucent Technologies/Bell Labs. (USA) [5116-59] MEMS variable optical attenuators for volume production, V. Vaganov, N. Belov, S. R. Hout, MegaSense, Inc. (USA) [5116-60] Monolithic III-V and hybrid polysilicon-III-V microelectromechanical tunable vertical cavity surface emitting lasers, E. M. Ochoa, J. A. Lott, Air Force Institute of Technology (USA); T. R. Nelson, Jr., Air Force Research Lab. (USA); A. Stintz, K. J. Malloy, Univ. of New Mexico (USA) [5116-61] Back-to-back micromirror device for optical add/drop multiplexer applications, Y. Lin, J. Chiou, National Chiao Tung Univ. (Taiwan) [5116-62] Enhancement on optical attenuation by non-smooth tunable mirror curvatures, C. Lin, W. Hsu, National Chiao Tung Univ. (Taiwan) [5116-63] Hexagonal optical micro-pillar cavity filters: design, fabrication, and characterization, F. Tung, Hong Kong Univ. of Science and Technology (Hong Kong); N. Ma, Zhejiang Univ. (China) and Hong Kong University of Science and Technology (Hong Kong); A. W. Poon, Univ. of Chicago (USA) and Yale Univ. (USA) [5116-64] Fabrication of a highly efficient optical modulator based on silicon-on-insulator, R. M. Atta, A. G. R. Evans, Univ. of Southampton (United Kingdom); J. C. Png, G. T. Reed, Univ. of Surrey (United Kingdom) [5116-65] Posters -TuesdayPoster presenters will stand by their posters from 17.30 to 19.00 to answer questions. Posters must be removed at the end of the poster session.
Wednesday 21 May
SESSION 9 Wed. 9.45 to 12.55
RF/Integrated CircuitsPolymers in RF and millimeterwave applications (Invited Paper), K. M. Grenier, LAAS CNRS (France); V. Lubecke, Lucent Technologies/Bell Labs. (USA); F. Bouchriha, L. Rabbia, D. Dubuc, P. Pons, R. Plana, LAAS CNRS (France) [5116-66] Infrared wavelength selective micromachined microbolometers, D. Neikirk, J. W. Kim, Univ. of Texas/Austin (USA) [5116-67] Finline technology for millimeter wave MEMS, J. S. Fu, Y. Lu, J. Ma, Z. Shen, Nanyang Technological Univ. (Singapore) [5116-68] Laser annealing for high-Q MEMS resonators, K. Aubin, M. Zalalutdinov, Cornell Univ. (USA); B. Houston, Naval Research Lab. (USA); A. Zehnder, J. M. Parpia, H. G. Craighead, Cornell Univ. (USA) [5116-69] Fabrication of a three-dimensional inductor coil using excimer laser micromachining, K. I. Jolic, M. K. Ghantasala, Swinburne Univ. of Technology (Australia) [5116-70] High-density multi-layer connection technology for MEMS and CMOS application, S. Bai, R. Fasching, F. Prinz, Stanford Univ. (USA) [5116-71] Optically controlled microwave switch device, A. J. Viitanen, S. A. Tretyakov, Helsinki Univ. of Technology (Finland) [5116-72] Hot electron bolometer on membranes for THZ applications, M. Salez, Observatoire de Paris (France); P. Pons, LAAS CNRS (USA); J. Baubert, Y. Delorme, Observatoire de Paris (France); G. Goltsman, Moscow State Pedagogical Univ. (Russia) [5116-73] Submillimeter mixer based on superconductive parallel junction arrays, F. Boussaha, Observatoire de Paris (France) [5116-74] Lunch Break SESSION 10 Wed. 14.15 to 17.30
MEMS IIIMonolithic photovoltaic minipanels using bulk micromachining techniques, S. Bermejo, P. R. Ortega, L. Castañer, Univ. Politècnica de Catalunya (Spain) [5116-75] Stress release of PECVD oxide by RTA, R. Charavel, J. P. Raskin, Univ. Catholique de Louvain (Belgium) [5116-76] Modeling and simulation of the geometrical effect by manufacturing tolerances for micro-electro-mechanical systems, J. W. Kim, O. S. Kwon, T. Ha, J. Oh, T. Won, Inha Univ. (South Korea) [5116-77] Fabrication of conductive AFM probes and their evaluation for carrier mapping, M. Fouchier, P. Eyben, IMEC (Belgium); D. Alvarez, Infineon Technologies AG (Germany) and IMEC (Belgium); N. Duhayon, IMEC (Belgium); W. Vandervorst, IMEC (Belgium) and KULeuven (Belgium) [5116-78] Characterization of front- to backwafer alignment and bulk micromachining using electrical overlay test structures, H. W. Van Zeijl, J. Slabbekoorn, Technische Univ. Delft (Netherlands) [5116-79] Modification on surface roughness by combining dry and wet etching, C. Lee, W. Hsu, National Chiao Tung Univ. (Taiwan) [5116-80] Matching different size mask to improve stepper throughput effectively, F. Weng, H. Hsu, C. Chang, Y. Hsiao, C. Kuo, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) [5116-81] Microlens design for compact lens system, H. Hsu, F. Weng, C. Chang, Y. Hsiao, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) [5116-82] Microfabrication using selective laser sintering micron metal powder,
J. Chen, T. Zuo, Beijing Polytechnic Univ. (China) [5116-83]
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