Published Final Programs

·          Microelectronics: Design, Technology, and Packaging

·          BioMEMS and Nanotechnology

·          Device and Process Technologies for Microelectronics, MEMS, and Photonics

·          Photonics: Design, Technology, and Packaging

 


Proceedings of SPIE Volume: 5276

Final Program

Device and Process Technologies for Microelectronics, MEMS, and Photonics

 

 

SPIE's International Symposium on
Microelectronics, MEMS, and Nanotechnology
9-12 December 2003
The University of Western Australia
Perth, Australia

 

2003 Symposium Chairs:
Lorenzo Faraone, The Univ. of Western Australia
Vijay K. Varadan, The Pennsylvania State Univ. (USA)

 

SPIE Conference 5276

Device and Process Technologies for Microelectronics, MEMS, and Photonics, III

Conference Chair:

Jung-Chih Chiao, University of Texas at Arlington (USA)

Co-chairs:

Alex J. Hariz, Univ. of South Australia (Australia);

David N. Jamieson, Univ. of Melbourne (Australia);

Giacinta Parish, Univ. of Western Australia (Australia);

Vijay K. Varadan, The Pennsylvania State Univ. (USA)

Introduction:
This conference covers MEMS, optical MEMS, RF MEMS, and microelectronics at the device and process technology level.
Scope:
Materials: MEMS and nanomachining materials, smart materials, material processing, material issues.
Process: Process technologies for MEMS devices and components, micro/nanomachining fabrication techniques, etching and deposition technologies, LIGA technologies, advanced fabrication techniques, nanomachining techniques.
Devices: MOEMS and RF MEMS devices, actuators, sensors, micro-components.
Systems: Advanced technologies and applications -- optical, RF and sensors, applications for micro-/nano-technologies, integrated devices and applications, impact of device and processing technologies on applications and system levels.
Reliability: impact of material, processing techniques, and device technologies on reliability issues.

 

Program Committee:

David D. Awschalom, Univ. of California/Santa Barbara (USA);

Simon A. Brown, Univ. of Canterbury (New Zealand);

Carles Cané, Ctr. Nacional de Microelectrónica (Spain);

Mu Chiao, Univ. of British Columbia (Canada);

J. Allen Cox, Honeywell Inc. (USA);

Nico F. de Rooij, Univ. de Neuchatel (Switzerland);

Masayoshi Esashi, Tohoku Univ. (Japan);

Joseph Ford, Optical Micro Machines, Inc. (USA);

Hiroyuki Fujita, Univ. of Tokyo (Japan);

Muralidhar K. Ghantasala, Swinburne Univ. of Technology (Australia);

Frederic Green, Univ. of New South Wales (Australia);

Klas Hjort, Uppsala Univ. (Sweden);

Wensyang Hsu, National Chiao Tung Univ. (Taiwan);

Yang-Tung Huang, National Chiao Tung Univ. (Taiwan);

Jerome F. Jakubczak, Sandia National Labs. (USA);

Chantal G. Khan Malek, Univ. Paris-Sud (France);

Eun S. Kim, Univ. of Southern California (USA);

Harri K. Kopola, VTT Electronics (Finland);

Youngwoo Kwon, Seoul National Univ. (South Korea);

Rongming Lin, Nanyang Technological Univ. (Singapore);

Victor M. Lubecke, Univ. of Hawaii at Manoa (USA);

Karen Markus, JDS Uniphase Corp. (USA);

Jose Mireles, Univ. of Texas/Arlington (USA);

Koji Mizuno, Tohoku Univ. (Japan);

Sangeneni Mohan, Indian Institute of Science (India);

Ash M. Parameswaran, Simon Fraser Univ. (Canada);

Gabriel M. Rebeiz, Univ. of Michigan/Ann Arbor (USA);

Kazuo Sato, Nagoya Univ. (Japan);

Jun-Hwan Sim, Korea Maritime Univ. (South Korea);

Dinesh K. Sood, RMIT Univ (Australia);

Ooi Kiang Tan, Nanyang Technological Univ. (Singapore);

Vasundara V. Varadan, National Science Foundation (USA);

Steve J. Walker, Integrated Micromachines Inc. (USA);

Sai-Peng Wong, Chinese Univ. of Hong Kong (Hong Kong);

Huikai Xie, Univ. of Florida (USA);

Roland Zengerle, Albert-Ludwigs-Univ. (Germany)  

Created by J.C. Chiao