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Published Final Programs
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Micro-and Nanotechnology: Materials, Processes, Packaging, and
Systems |
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SPIE's
International Symposium on 12-15 December University of New South Wales 2004
Symposium Chairs: |
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SPIE Conference 5650
Micro-and Nanotechnology: Materials, Processes, Packaging, and Systems
II
Conference Chair:
Jung-Chih Chiao, Univ. of Texas/ Arlington
Co-chairs:
David N. Jamieson, Univ. of Melbourne (Australia);
Lorenzo Faraone, Univ. of Western Australia (Australia);
Andrew S. Dzurak, Univ. of New South Wales (Australia)
Introduction
As technologies progress,
challenges abound as MEMS, photonic, microelectronic, nanoelectronic and
quantum devices push the boundaries of current processing technologies. This
includes adapting current processing technology, and developing new
materials, structures, and techniques. MEMS and NEMS, in particular, bring
together researchers from multidisciplinary backgrounds and builds on the
fabrication and manufacturing technologies that have been developed by the
VLSI and precision engineering industries. This conference is intended to
bring together the process developers and integrators, device researchers,
and manufacturing engineers interested in the present and future state of
electronic, photonic, quantum and MEMS device processing technologies. The
topics covered in the conference will be novel processes, process integration
of MEMS, ICs, sensors and photonic components, new applications of existing
processing technologies – particularly to new commercial products, and
manufacturing-driven process development. Scopes
Nano and micro technologies: quantum computer technologies, self assembly and organizing techniques, nanoelectromechanical systems (NEMS), quantum electromechanical systems (QEMS), advanced synchrotron mediated processes, terahertz frequency and millimeterwave/submillimeterwave technologies. Materials: semiconductor materials, ceramics,
polymers, electroformed materials, piezoelectric materials, photonic bandgap
materials, nanoparticles, smart materials, novel materials and material
issues. Processes: atomic force microscopy (AFM), process
metrology, dicing and assembly methods, packaging processes, processing
effects on yield and reliability, yield management and enhancement, laser
machining, high-aspect ratio microfabrication technologies, photolithography,
microstereolithography and new etching/deposition techniques. Devices: device architectures, micro/nanoscale devices, MOEMS, RF MEMS, BioMEMS, fluidics, self-assembly devices, microinstruments, chemical/biomedical analysis microsystems, sensors and actuators. Compatibility: integrated packaging, hybrid and integrated systems, .process integration between MEMS and ICs, planarization, materials compatibility, bulk and surface micromachining integration, electrical-mechanical integration techniques, manufacturing issues, and environmental consideration. |
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Program
Committee:
Program Committee:
Simon A. Brown, Univ. of Canterbury (New Zealand);
Mu Chiao, Univ. of British Columbia (Canada);
Robert G. Clark, Univ. of New South Wales (Australia);
Nicolaas F. de Rooij, Univ. de Neuchâtel (Switzerland);
John M. Dell, Univ. of Western Australia (Australia);
Masayoshi Esashi, Tohoku Univ. (Japan);
Bradley Ferguson, Tenix Systems Pty. Ltd. (Australia);
Paul D. Franzon, North Carolina State Univ. (USA);
Hiroyuki Fujita, Univ. of Tokyo (Japan);
Thomas George, Jet Propulsion Lab. (USA);
Katia M. Grenier, LAAS-CNRS (France);
Kazuhiro Hane, Tohoku Univ. (Japan);
Alex J. Hariz, Univ. of South Australia (Australia);
Erol C. Harvey, Swinburne Univ. of Technology (Australia);
Hng Huey Hoon, Nanyang Technological Univ. (Singapore);
Wensyang Hsu, National Chiao Tung Univ. (Taiwan);
Kohei M. Itoh, Keio Univ. (Japan);
Chennupati Jagadish, The Australian National Univ. (Australia);
Chantal G. Khan-malek, CNRS (France);
Yong-Hyup Kim, Seoul National Univ. (South Korea);
Laszlo B. Kish, Texas A&M Univ. (USA);
Ronald A. Lawes, Rutherford Appleton Lab. (United Kingdom);
Liwei Lin, Univ. of California/Berkeley (USA);
Cheng-Hsien Liu, National Tsing Hua Univ. (Taiwan);
Victor M. Lubecke, Univ. of Hawaii/Manoa (USA);
Meyya Meyyappan, NASA Ames Research Ctr. (USA);
Samuel P. Mickan, The Univ. of Adelaide (Australia);
Sangeneni Mohan, Indian Institute of Science (India);
Ash M. Parameswaran, Simon Fraser Univ. (Canada);
Giacinta Parish, Univ. of Western Australia (Australia);
Olaf Reinhold, Defence Science and Technology Organisation (Australia);
Olivia M. Samardzic, Defense Science and Technology Organization (Australia);
Kazuo Sato, Nagoya Univ. (Japan);
Michael J. Sinclair, Microsoft Corp. (USA);
Dinesh K. Sood, RMIT Univ. (Australia);
Yu-Chuan Su, National Tsing Hua Univ. (Taiwan);
Hitoshi Tabata, Osaka Univ. (Japan);
Hark Hoe Tan, The Australian National Univ. (Australia);
Ooi Kiang Tan, Nanyang Technological Univ. (Singapore);
Vasundara V. Varadan, National Science Foundation (USA);
Sai Peng Wong, Chinese Univ. of Hong Kong (Hong Kong China);
Huikai Xie, Univ. of Florida
(USA)
Created by
J.C. Chiao