Dr. Choong-Un Kim
Professor & Graduate Advisor
Office: (817) 272-5497
Ph.D. University of California at Berkeley, 1993
M.S. Seoul National University, Korea, 1987
B.S. Seoul National University, Korea, 1985
Full Curriculum Vitae
Research Lab Page
Electrical Properties of Materials (MSE 5336)
Dr. Kim's research focuses primarily on design and characterization of electronic materials used on modern devices. He has worked on various projects, ranging from lead free alloy development to the reliability assessment of Cu/low-k interconnects.
While many of these research projects are still ongoing, his recent research subject is built primarily around the metrology. This research is spurred by the fact that the majority of current metrologies practiced in science and engineering fields are inadequate to support the current and future technologies.Microelectronic devices are rapidly scaling down to nanoscale. The same trend exists in other areas, especially with the advancement of nanostructured materials. New metrologies are the key for the desired progress of these fields, and his research team, in collaboration with industries, is developing various types of the problem-oriented metrologies with greater efficiency and accuracy.
D. M. Meng, N. Michael, C.-U. Kim, Y.-J. Park, and L. Matz, “Study of Pore Structure and Stability in Porous Low-k Interconnects using Electrolyte Voltammetry”, Appl. Phys. Lett. 88, 261911 (2006).
E.L. Shoemaker, C.-U. Kim, M. C. Vogt, "CO2 sensing mechanism of electrocatalytic sensor based on a W-stabilized Bi oxide solid electrolyte and cyclic voltammetry measurement techniques", Sensors and Actuators B 110, 89-100 (2005).
M.-J. Lee, and C.-U. Kim, "Formation of HgTe Nanodisks Embedded in PbTe Matrix by Precipitation Phenomena", Nano Letters 3, 1607 (2003).
A.Yildiz, D. P. Butler, Z. Celik-Butler, and C.-U. Kim, Crystallization and Pyroelectric Effect of Semiconducting YbaCuO Thin Films Deposited at Different Temperatures", J. Vac. Sci. and Technol. B, 1 (2003).
N.L. Michael, C.-U. Kim, P. Gillespie, and R. Augur, "Mechanism of Reliability failure in Cu interconnects with Ultralow-k materials", Applied Physic Letters 83, 1959 (2003).