Facility

Technics Micro-RIE Series 800 Plasma System

Etchable materials: silicon nitride, silicon dioxide, single crystal and poly silicon
Etch electrode: 9’’ diameter stainless steel, water cooled
RF Power: 200 Watts (variable), 30 kHz
Gases: Two channels with MFCs (mass flow controllers)

 


All Etching-Ashing Facilities

• Diener Electronics Asher
• Plasmatherm Etcher
• Supercritical Point Dryer
• Technics Micro-RIE Series 800 Plasma System
• TRION Deep Reactive Ion Etching (DRIE) System
• TRION MINILOCK II RIE System
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