Facility

Technics Micro-RIE Series 800 Plasma System

Etchable materials: silicon nitride, silicon dioxide, single crystal and poly silicon
Etch electrode: 9’’ diameter stainless steel, water cooled
RF Power: 200 Watts (variable), 30 kHz
Gases: Two channels with MFCs (mass flow controllers)

 


All Etching-Ashing Facilities

Diener Electronics Asher
Plasmatherm Etcher
Supercritical Point Dryer
Technics Micro-RIE Series 800 Plasma System
TRION Deep Reactive Ion Etching (DRIE) System
TRION MINILOCK II RIE System
Back to All Facilities