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Desposition- AJA ATC ORION Series Thermal Evaporation System
- AJA ATC ORION Series Evaporation System
- AJA ATC ORION Series UHV Sputtering System
- CHA Electron-Beam Evaporator
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DISTINGUISHED SPEAKER SERIES MICRO & NANO-SYSTEMS
ATTEND SPEAKER SERIES
RSVP to Thanh Bui at tbui@uta.edu or 817-272-1536. This series is in conjunction with EE 5344 – Introduction to MEMS, which is offered by UTA. Information about this course and microsensor activities at UTA can be obtained from Professor Z. Celik-Butler at zbutler@uta.edu. - CONTACTS
Facility
EVG 520IS Wafer Bonder
EVG 520IS is a 4” wafer bonding equipment. It is capable of various bonding such as Anodic, Fusion, Adhesive, Glass frit, Eutectic with alignment accuracy of 3-5 microns.
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UT Arlington | College of Engineering | Contacts
Open to scientists with and outside UT Arlington, The Nanotechnology
Research & Education Center is the preeminent university-based
nanotechnology research, development, and teaching facility in North Texas.