Facility

EVG 520IS Wafer Bonder

EVG 520IS is a 4” wafer bonding equipment. It is capable of various bonding such as Anodic, Fusion, Adhesive, Glass frit, Eutectic with alignment accuracy of 3-5 microns.

 


All Dicing-and-Bonding Facilities

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EVG 520IS Wafer Bonder
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