Facility

Microautomation 1100 Dicing Saw

Programmable dicing saw
For dicing silicon, and glass wafers
Maximum wafer size: 6” diameter

 


All Dicing-and-Bonding Facilities

Disco DAD3220 Automatic Dicing Saw, 160mm
EVG 520IS Wafer Bonder
Kulicke & Soffa (K&S) Model 4124-2: Ball Bonder
Kulicke & Soffa Model 4524 Ball Bonder
Microautomation 1100 Dicing Saw
West Bond Model 7476E-79 Wedge Wire Bonder
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