Facility

TRION MINILOCK II RIE System

Etching of InP, GaAs and AlGaAs
Substrate size: 4” diameter or smaller
Electrostatic chuck with backside helium cooling
Laser endpoint detection (Intellemetrics LEP 300)

TRION MiniLock Reactive Ion Etcher
 


All Etching-Ashing Facilities

Diener Electronics Asher
Plasmatherm Etcher
Supercritical Point Dryer
Technics Micro-RIE Series 800 Plasma System
TRION Deep Reactive Ion Etching (DRIE) System
TRION MINILOCK II RIE System
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