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Monday 22 January
SESSION 1 Mon. 1:00 to 2:20 pmLasersPulse-width dependency of the fabricating resolution of the two-photon absorption photo-polymerization, H. J. Kong, S. W. Yi, D. Yang, Korea Advanced Institute of Science and Technology (South Korea); K. Lee, Hannam Univ. (South Korea); J. Kim, T. Lim, S. Kim, Korea Advanced Institute of Science and Technology (South Korea) [6462A-01] Small-scaled and microfeatured functional prototypes by laser sintered polyetheretherketone, T. Rechtenwald, Bayerisches Laserzentrum GmbH (Germany); D. Phole, Univ. of Erlangen (Germany); M. H. M. Schmidt, Bayerisches Laserzentrum GmbH (Germany) [6462A-02] Characterization of femtosecond laser ablation and deposition through spectral interferometry, S. Bera, A. J. Sabbah, J. M. Yarbrough, C. G. Allen, B. Winters, C. G. Durfee, J. A. Squier, Colorado School of Mines [6462A-03] Increasing femtosecond laser processing efficiency by hybridization with nanosecond laser, J. S. Yahng, B. H. Chon, C. H. Kim, Korea Research Institute of Standards and Science (South Korea); H. R. Kim, Bicronix Co., Ltd. (South Korea); S. C. Jeoung, Korea Research Institute of Standards and Science (South Korea) [6462A-04] SESSION 2 Mon. 2:20 to 4:50 pmHigh Aspect Ratio Devices and Etching TechniquesMicrofabricated 3D polymeric structure with SU-8, S. W. Yi, H. J. Kong, Korea Advanced Institute of Science and Technology (South Korea) [6462A-05] A new UV-lithography photoresist for fabrication of high-aspect-ratio microstructures, R. Yang, S. A. Soper, W. Wang, Louisiana State Univ. [6462A-06] Plasma etching of positively sloped silicon structures, S. Lai, K. D. Mackenzie, D. J. Johnson, R. J. Westerman, Oerlikon USA Inc. [6462A-07] The silicon mold fabrication of a kind of micro-optical resonator and coupler, H. Ju, Wakayama Univ. (Japan) [6462A-08] Processing parameters for the development of glass/ceramic MEMS, J. A. Stillman, Univ. of California/Los Angeles and The Aerospace Corp.; J. W. Judy, Univ. of California/Los Angeles; H. Helvajian, The Aerospace Corp. [6462A-09] Use of silane-based primer on silicon wafers to enhance adhesion of edge-protective coatings during wet etching: application of TALON(TM) wrap process, J. Dalvi-Malhotra, G. Brand, X. Zhong, Brewer Science, Inc. [6462A-10] SESSION 3 Mon. 4:50 to 5:50 pmDevicesNew emerging MEMS applications, E. Mounier, Yole Dévelopment (France) [6462A-11] Design of high-sensitive acoustic sensor using PMN-PT single crystal, S. Q. Lee, H. Kim, K. H. Park, Electronics and Telecommunications Research Institute (South Korea); K. S. Moon, Y. K. Hong, San Diego Stage Univ. [6462A-12] Fabrication technology of Si microfluidic devices for microbial cell trapping, R. M. Badam, R. Nagarajan, L. Zhu, C. Y. Teo, X. Peh, H. Feng, N. Balasubramanian, W. Liu, Institute of Microelectronics (Singapore) [6462A-13] Posters - WednesdayAll symposium attendees are invited to attend the poster sessions provided as an opportunity to enjoy refreshments while reviewing poster papers. Each evening will represent a different set of conferences to promote opportunities for networking with colleagues in your field. Attendees are encouraged to review the high-quality papers that are presented in this alternate format and to interact with the poster authors. Attendees are requested to wear their conference registration badges to the poster sessions.
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