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19 - 24 January 2008
San Jose Convention
Center
San Jose, CA USA |
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Micromachining and Microfabrication Process Technology
XII
Conference 6882 - Proceedings of SPIE Volume
6882
Dates:
Tuesday-Wednesday 22 - 23 January 2008
Part
of program track on Technical
Conferences
Conference
Chairs Mary-Ann Maher, SoftMEMS; Jung-Chih
Chiao, The Univ. of Texas/Arlington; Paul J.
Resnick, Sandia National Labs.
Program
Committee Mu Chiao, The Univ. of British
Columbia (Canada); Debabani Choudhury, HRL Labs., LLC;
Eric Donzier, Schlumberger (United Kingdom); David
A. Koester, MCNC; Sanjay Krishna, The Univ. of New
Mexico; Tamal Mukherjee, Carnegie Mellon Univ.;
Yu-Chuan Su, National Tsing Hua Univ. (Taiwan); T.
C. Yih, Oakland Univ.; Nan Zhang, General MEMS
Corp. |
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Tuesday 22 January
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Posters-Tuesday
Date: Tuesday 22
January
Time: 6:00 PM - 7:30 PM
All symposium attendees are
invited to attend the poster sessions provided as an
opportunity to enjoy refreshments while reviewing poster
papers. Each evening will represent a different set of
conferences to promote opportunities for networking with
colleagues in your field. Attendees are encouraged to review
the high-quality papers that are presented in this alternate
format and to interact with the poster authors. Since poster
sessions are technical events and part of the conference
program, it is not appropriate for spouses and families to
attend these events. Attendees are requested to wear their
conference registration badges to the poster sessions.
Poster presenters may post their poster papers Tuesday
morning starting at 10:00 am in the Civic Auditorium, and will
need to remove their papers immediately following the poster
session that evening. Any papers left on the boards at the
close of the poster session will be considered unwanted and
will be discarded. SPIE assumes no responsibility for posters
left up after the end of each poster session. Poster authors
should be at their papers from 6:00 pm to 7:30 pm to answer
questions from attendees. |
The effect of size on the etch rates of structures
fabricated from photostructurable glass-ceramic Paper
6882-18 |
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Author(s): Janet A. Stillman, The Aerospace Corp. and
Univ. of California/ Los Angeles; Jack W. Judy, Univ. of
California/Los Angeles; Henry Helvajian, The Aerospace Corp.
Photostructurable
glass-ceramics (PSGCs), although not yet widely used, are well
suited to many micro-optical and micromechanical applications.
In this experiment, we examined the dependence of the chemical
etch rate on the sizes of structures made from Foturan, a
commercially available PSGC. We fabricated several types of
test structures in 1-mm-thick Foturan samples that ranged in
width from 10 µm to more than 1 mm. Samples were etched at
room temperature in 5% HF under ultrasonic agitation. We
report the measured etch rates, the times at which
through-structures were released for various channel widths,
and the variations in measurements for each class of sample.
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Effect of formulation variables on the formation of
cholesterol nanoparticles of clozapine prepared by solvent
evaporation method Paper
6882-19 |
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Author(s): Nirav V. Patel, Anand Pharmacy College/Gujarat
(India); Rajnikant C. Patel, KB Raval College Of
Pharmacy/Ahmedabad (India); Mayur P. Patel, Alembic Ltd.
(India)
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Dry film process development for electroplating and
lift-off of metal layers Paper
6882-20 |
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Author(s): Phaninder R. Kanikella, Matthew J. O'Keefe,
Chang-Soo Kim, Univ. of Missouri/Rolla
A
dry film photoresist was used to fabricate microstructures
with high sidewall verticality on silicon wafers. A fractional
factorial design (FFD) was used to study the variation in
sidewall angles with processing parameters. The most dominant
factor in determining the slope of the sidewall was exposure
energy, and a near vertical sidewall of about 86° was obtained
under optimized conditions. The lithographically patterned dry
film molds with optimized sidewall angle were used for
electroplating copper and for lift-off of sputtered metal.
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Electrical properties of thin epoxy–based polymer layers
filled with n–carbon black particles Paper
6882-21 |
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Author(s): Marijan Macek, Univ. v Ljubljani (Slovenia);
Marta Klanjsek Gunde, Nina Hauptman, National Institute of
Chemistry Slovenia (Slovenia)
The
conductive carbon black was applied in the epoxy-based SU8
matrix material. Different weight concentrations of solid
particles were used to prepare dispersions. The layers
underwent the standard recommended procedure for SU8 photo
resist. The prepared n–composites were analyzed in terms of
specific resistance of thin films deposited onto glassy
substrates. It was found out, that a proper dispersion of
n-particles plays a crucial role. Samples with the same
composition (wt% of n–CB) differ in specific resistance by few
orders of the magnitude. Scanning electron microscopy confirms
that the agglomeration of n–particles decreases the
conductance of the samples.
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Wednesday 23 January
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Session 1: Bio-devices
Date: Wednesday 23
January
Time: 9:00 AM - 10:20 AM
Session
Chair: Nan Zhang, General MEMS
Corp. |
BioMEMS-enabling technologies for POC testing Paper
6882-1 |
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Time: 9:00 AM - 9:20 AM
Author(s): Nan Zhang, General MEMS Corp.
Recent
development of innovative disposable lab-on-a-chip system will
be reviewed. They typical Lab-on-chip system includes passive
or active microfluidics and varying detection metrologies. The
technology advance in Bio-MEMS has opened a new era for the
point-of-care testing in clinical diagnostics. Several
challenging issues in the development of the disposable
lab-on-a-chip have been explored and addressed in this review.
A new disposable “dynamic" lab-on-a-chip developed for
immunoassay is presented in this paper as an example of
Bio-MEMS application.
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Advances in CLIPP for the fabrication of surface modified
micro-fluidic Paper
6882-2 |
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Time: 9:20 AM - 9:40 AM
Author(s): Michael P. C.Watts, Optical Associates, Inc.;
Robert Sebra, Univ. of Colarado at Boulder; Helen Simms, Univ.
of Colorado at Boulder; Kristi Ansteh, Univ of Colarado at
Boulder
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Fabrication of silicon nanowall chips for DNA binding
yield enhancement (Canceled)Paper 6882-3 |
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Time: 9:40 AM - 10:00 AM
Author(s): Ramana M. Badam, Institute of Microelectronics
(Singapore); Raghavan Uppili, SiMEMS Pte Ltd. (Singapore);
Balasubramanian Narayanan, Institute of Microelectronics
(Singapore)
In
this work we demonstrate fabrication of silicon chips for the
enhancement of DNA binding yield. Highly dense three
dimensional nano-structure wall arrays were formed using deep
UV lithography and reactive-ion etch techniques. Such arrays
enhanced the surface-area by fourteen times for a given chip
base area. These chips were further functionalised for DNA
binding and yield was quantified. We achieved more than four
times of DNA binding yield compared to flat silicon surface.
Such devices have potential biological applications such as
PCR amplification. As the processes designed were production
adapt-able cost effectiveness can also be achieved.
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Microfabricated needles for transdermal delivery of
macromolecules and nanoparticles: fabrication methods and
transport studies (Canceled)Paper 6882-4 |
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Time: 10:00 AM - 10:20 AM
Author(s): Rajnikant C. Patel, KB Raval College Of
Pharmacy/Gujarat (India); Nirav V. Patel, Anand Pharmacy
College/Gujarat (India)
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Coffee Break 10:20 AM - 10:50 AM
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Session 2: MEMS and MOEMS
Date: Wednesday 23
January
Time: 10:50 AM - 12:50 PM
Session
Chair: Mary-Ann Maher, SoftMEMS |
Micromachining of a fiber-to-waveguide coupler using
grayscale lithography and through-wafer etch Paper
6882-5 |
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Time: 10:50 AM - 11:10 AM
Author(s): Thomas E. Dillon, Shouyuan Shi, Janusz
Murakowki, Dennis W. Prather, Univ. of Delaware
For
some time, micro-optics and photonics have relied on
fabrication processes borrowed from the well-established
silicon IC industry. However, new fabrication methodologies
must be developed for greater flexibility in the machining of
micro-optic devices. To this end, we have explored grayscale
lithography for its ability to sculpt materials arbitrarily in
three dimensions, thus providing the flexibility to realize
optical surfaces to shape, transform, and redirect the
propagation of light efficiently. We present a
fiber-to-waveguide coupling structure utilizing a smoothly
contoured lensing surface in an SOI wafer, created using
grayscale lithography. We will discuss the complete
fabrication flow in detail, with particular attention directed
to the required models and process control that enable precise
sculpting of the optical surfaces needed to achieve a high
efficiency device.
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Laser beam shaping for micromaterial processing using a
liquid crystal display Paper
6882-6 |
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Time: 11:10 AM - 11:30 AM
Author(s): Fabian Friederich, Ulrich Klug, Mark Boyle,
Laser Zentrum Hannover e.V. (Germany)
Laser
material processing demands high beam quality with different
beam profiles, usually achieved by custom-built masks. A
computer controlled microdisplay provides the opportunity to
actively control and alter the spatial distribution of the
incident electromagnetic field. Phase changes by a fraction of
a wavelength up to 2π in the IR-Region enhance this element as
an adaptive diffractive beam shaping device. The
application of a liquid crystal on Silicon (LCoS) microdisplay
as a beam shaping device for material processing will be
discussed. Thereby, a simple method for characterization and
calibration of the liquid crystal display will be
demonstrated.
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A novel fabrication technology for anti-reflex wafer-level
vacuum packaged microscanning mirrors Paper
6882-7 |
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Time: 11:30 AM - 11:50 AM
Author(s): Marten Oldsen, Ulrich Hofmann, Hans-Joachim
Quenzer, Kai Gruber, Bernd Wagner, Fraunhofer Institut für
Siliziumtechnologie (Germany)
Resonantly
operating microfabricated scanning mirrors are supposed to be
a key component for a variety of mass applications in the
field of laser projection and imaging. To ensure the
feasibility of mass production and to protect the devices from
ambient influences the devices must be hermetically
encapsulated on wafer level. Fraunhofer ISIT developed a
complete process technology for wafer-level vacuum packaged
scanning micromirrors with an integrated getter layer. The
wafer-level package delivers perfect optical quality and
effectively eliminates parasitic laser spots due to laser beam
reflections at the glass interfaces.
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Parallel kinematic mechanism-based monolithic XY
micro-positioning stage Paper
6882-8 |
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Time: 11:50 AM - 12:10 PM
Author(s): Deepkishore Mukhopadhyay, Jingyan Dong,
Placidus M. Ferreira, Univ. of Illinois at Urbana-Champaign
This
paper presents the design, kinematic and dynamic analysis,
fabrication and characterization of a novel monolithic
micro-positioning XY stage. The design of the proposed
micro-positioning stage is based on a Parallel Kinematic
Mechanism (PKM). The stage mechanism is fabricated on a
Silicon-On-Insulator (SOI) substrate and is actuated by
integrated electrostatic rotary comb drives. The fabricated
stages have a motion range of more than 30 microns along the X
and Y directions, at a driving voltage of 200V.
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Microinductors integrated on silicon for dc-dc
converters Paper
6882-9 |
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Time: 12:10 PM - 12:30 PM
Author(s): Taoufik El Mastouli, Jean-Pierre Laur, Lab.
d'Analyse et d'Architecture des Systèmes (France) and Paul
Sabatier Univ. (France); Jean-Louis Sanchez, Lab. d'Analyse et
d'Architecture des Systèmes (France)
For
applications such as computers, cellular telephones and
Microsystems, it is essential to reduce the size and the
weight of DC-DC converters. To miniaturize the passive
components, the micromachining techniques provide solutions
based on low-temperature process compatible with active part
of the converter. This paper deals with the integration on
silicon of “spiral-type” inductor topology. Electroplating
techniques are used to achieve the copper conductor and the
CoNiFe laminated magnetic core and several investigations on
the electroplating bath's parameters have been realized in
order to obtain the adequate magnetic proprieties. Finally, a
1µH microinductor prototype has been characterized.
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Electrodeposition of Au for self-assembling 3D
microstructures Paper
6882-10 |
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Time: 12:30 PM - 12:50 PM
Author(s): Michail E. Kiziroglou, Anisha G. Mukherjee,
Imperial College London (United Kingdom); Richard W. Moseley,
Microsaic Systems Ltd. (United Kingdom); Paul Taylor, Semefab
(Scotland) Ltd. (United Kingdom); Suneat Pranonsatit, Andrew
S. Holmes, Eric M. Yeatman, Imperial College London (United
Kingdom)
Rotation
of planar structures into out-of-plane orientations can
greatly increase the 3-dimensionality of microstructures.
Previously this has been achieved for high-Q Cu inductors
using self-assembly based on surface tension in meltable PbSn
hinges. However, Cu has problems of oxidation, and Pb-free
hinge material is required for legislative reasons. Here, Au
is used instead of Cu for the fabrication of self-assembled 3D
inductors. Furthermore, pure Sn is used instead of Pb-Sn as
the hinge material. Additional layers are introduced to
prevent inter-diffusion, and to protect hinges from oxidation.
The developed fabrication techniques are compatible with
post-processing on active CMOS circuits.
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Lunch/Exhibition Break 12:50 PM - 2:20 PM
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Session 3: Etching and
Lithography
Date: Wednesday 23
January
Time: 2:20 PM - 5:10 PM
Session
Chair: Harold D. Stewart, Sandia National
Labs. |
Microcantilever force sensor fabricated by femtosecond
laser micromachining (Canceled)Paper 6882-11 |
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Time: 2:20 PM - 2:40 PM
Author(s): Panos S. Shiakolas, Nitin Uppal, Mohammad
Mayyas, The Univ. of Texas at Arlington
This
work presents the use of femtosecond Ti: Sapphire laser to
fabricate a micro cantilever for contact force sensing
applications. The microcantilever with micro/nanoforce
resolution is designed and its performance optimized reference
to the resistance change as function of applied force. The
microcantilever force sensor is composed of a PMMA film
sputtered with copper. Optimization criterions for the
resistance change vs. force/deflection have been
mathematically derived for the laminated layers. The micron
and submicron machining capabilities along with the
optimization criterions have allowed introducing a range of
MEMS FS which are suitable for force and displacement
measurement of MEMS actuators.
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Fabrication of buried channel waveguides in
polydimethylsiloxane (PDMS) using proton beam writing (PBW):
Applications for fluorescence detection in microfluidic
channels Paper
6882-12 |
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Time: 2:40 PM - 3:00 PM
Author(s): Chammika N. B.Udalagama, Sook Fun Chan,
Sureerat Homhuan, Andrew A. Bettiol, Frank Watt, National
Univ. of Singapore (Singapore)
Proton
beam writing (PBW) is a lithographic technique that utilizes
MeV protons in a direct write mode to fabricate micro/nano
features in suitable resist material. Further, PBW can also
produce buried channel waveguides via the change in refractive
index brought about by the energy deposition process.
Polydimethylsiloxane (PDMS) is an optically clear,
biocompatible polymer that can be readily used with a mold
(such as that created with PBW) to produce micro/nano fluidic
channels necessary for biophotonics chips. In this work we
present results of the fabrication and characterization of
proton beam written buried channel waveguides in
Polydimethylsiloxane (PDMS) as means of directly coupling
light into microchannels in biophotonics chips that depend on
the detection of fluorescence.
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MEMS post-processing of MPW dies using BSOI carrier
wafers Paper
6882-13 |
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Time: 3:00 PM - 3:20 PM
Author(s): Anisha G. Mukherjee, Michail E. Kiziroglou,
Andrew S. Holmes, Eric M. Yeatman, Imperial College London
(United Kingdom)
Multi-project-wafer
(MPW) services provide an economical route for prototyping of
new electronic circuit designs. However, addition of MEMS
functionality to MPW circuits by post-processing is difficult
and inefficient because MPW typically yields individual dies.
Our solution problem is to embed the MPW dies in a carrier
wafer prior to MEMS processing. We have developed a process
which allows 300 micrometer thick CMOS dies to be embedded in
a BSOI carrier prior to low-temperature processing for
integration of metal MEMS. Deep reactive ion etching is used
to form the required cavities in the device layer of a BSOI
wafer.
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Coffee Break 3:20 PM - 3:50 PM
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Microstructures with rounded concave and sharp-edged
convex corners in a single step wet anisotropic etching Paper
6882-14 |
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Time: 3:50 PM - 4:10 PM
Author(s): Prem Pal, Kazuo Sato, Nagoya Univ. (Japan);
Miguel Gosalvez, Helsinki Univ. of Technology (Finland);
Mitsuhiro Shikida, Nagoya Univ. (Japan)
The
conventional design of silicon micromachining based
microstructures exhibits stress concentration at the sharp
concave corners when load is applied which may initiate micro
cracks. By providing rounded concave corners instead of sharp
one, the stress can be smoothening, and that will improve the
mechanical efficiency. However, the fabrication of this type
of geometry is difficult as severe undercutting start at
convex and rounded concave corners during etching process.
In this work, we have developed the microstructures with
rounded concave and sharp-edged convex corners in
(100)-silicon wafer in a single step wet anisotropic etching.
It was realized by analyzing the etching characteristics of
TMAH solution when non-ionic surfactant NC-200 is added.
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TACD tool for innovative MEMS and MOEMS: a all-in-one
solution Paper
6882-15 |
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Time: 4:10 PM - 4:30 PM
Author(s): U. Triltsch, Stephanus Büttgenbach, Technische
Univ. Braunschweig (Germany)
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Sensitivity and stress of composite Si-micro/macro porous
silicon Paper
6882-16 |
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Time: 4:30 PM - 4:50 PM
Author(s): Sujatha L., Enakshi Bhattacharya, Indian
Institute of Technology Madras (India)
In
this paper we discuss the enhancement in sensitivity of
pressure sensors with Silicon/Porous Silicon (Si/PS) composite
membranes. Both micro and macro PS are formed on the silicon
membrane by electrochemical etching in aqueous and organic
electrolytes containing HF. Formation of microporous and
macroporous silicon produces stress on the membrane varying
with the porosity. This compressive stress causes an increase
in the offset voltage of the sensor. Though the composite
membranes exhibit saturation and hysteresis at higher
pressures, the response is linear at pressures below 1 bar
making it a viable option for sensing low pressures.
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Three dimensional waveguide fabrication in PMMA using
femtosecond laser micromachining system Paper
6882-17 |
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Time: 4:50 PM - 5:10 PM
Author(s): Panos S. Shiakolas, Nitin Uppal, Mohsin
Rizwan, The Univ. of Texas at Arlington
In
this work, a Ti: Sapphire femtosecond laser (800nm, ~100 fs
and 1 KHz) along with there translational (X, Y and Z) and one
rotational stages is used for the fabrication of three
dimensional waveguides in thick PMMA substrates. The combined
motion of these four stages can be used to achieve desired
three dimensional pattern inside transparent material. This
work will present the designing of 3D waveguide using
commercially available solid modeler and generation of
machining codes using customized post processor. Also, control
of laser process parameters to obtain desired feature quality
by minimizing self focusing and filament formation is
discussed.
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