In addition to the workshops and special sessions, the 2003 Symposium will feature five lunchtime (12:00 to 1:15 PM) panel sessions. These panel sessions provide attendees with opportunities to hear lively dialog and differing views from a panel of experts on subjects of current interest, while at the same time allowing a high level of audience interaction.
Participation in the panel sessions requires separate registration. Registration for panel session includes a box lunch.
Chi Wang and James Whelehan
IMS2003 Panel Sessions Co-Chairs
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PMA: Are we ready for a worldwide-capable multi-standard RF system ? Date & Time: Monday,
June 9, 12:00 PM to 1:00 PM Location: Ballroom Organizers: Yann DEVAL, IXL lab, France
Industrial experts from all over the world (Asia-Pacific, Europe
and America) will present which standards, from their point of view, a
future multi-standard system will have to address to provide worldwide
capabilities. The speakers' opinions are mostly due to political or economical
interest, as well as existing networks and skills, and thus depend on the
region the speakers come from. Speakers will talk about mobile phone, but not only: wireless digital data links are also of major importance, and so is positioning. Speakers:
Didier BELOT,
STMicroelectronics, France
Kenji ITOH,
Mitsubishi Elec. Corp., Japan
Rudolf Koch,
Infineon, Germany
Tadao Nakagawa,
NTT Corp., Japan
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PTUA: Surface Mount Technology: BGA versus Lead Frame Date
& Time: Tuesday,
June 10, 12:00 PM to 1:00 PM Location: Ballroom Organizers:
Alan
Lindner,
StratEdge Corporation
Joy Laskar , Georgia Tech
University This panel session will provide a lively debate on what is the
better surface mount packaging technology: BGA or Lead Frame. Amplifiers
to MUX circuits, each application has its own specific requirements. These
include the maximum size a component may be, the amount of heat it needs
to dissipate, what assembly processes are required, and what is the total
cost of the assembly. Two different scenarios will be presented. One will be a very high
volume, microwave and high-speed digital component. The other will be a
high power Ku band VSAT amplifier for a consumer set top box. The
manufacturing and process requirements and the range of electrical
performance will be addressed to determine the optimal surface mount
configuration. Speakers:
Alan Lindner, StratEdge
Corporation
Bob Griffin,
Micro Substrates Corporation
John Kennedy,
Skyworks Solutions Inc.
Rick
Sturdivant,
Multilink Corporation Brian Sousa, RF Micro Devices
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PTUB: The future of education in the area of micro-waves Date
& Time: Tuesday,
June 10, 12:00 PM to 1:00 PM Location: Ballroom Organizers:
Bruce
A. Eisenstein,
Drexel University
K.C. Gupta,
University of Colorado at Boulder The panel will discuss the future of education in the area of
microwaves with emphasis on what to teach and how to teach it. How should
technology be woven into the curriculum? What are the needs of industry?
How much emphasis should be placed on simulation software for design? What
about Maxwell? Speakers:
Mike Golio, Motorola Inc.
Jim Rautio,
Sonnet Software Inc.
Dave Rutledge,
Cal. Tech. University
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PWA: Issues Related to Commercial Uses of Ultra-Wideband
Communications Date
& Time: Wednesday,
June 11, 12:00 PM to 1:00 PM Location: Ballroom Organizers:
Roger
Kaul,
Johns Hopkins University
Gregory Lyons,
MIT Lincoln Laboratory Ultra-wideband (UWB) communications is entering the US commercial
marketplace operating within the specifications in the FCC’s Report and
Order issued in February 2002. UWB technologies are evolving and will be
used for short-range communication applications, such as personal area
networks. But issues remain to be resolved, such as:
The four speakers will address the above issues in this panel session. Adequate time will be allowed for questions from the audience. Speakers: Mike Marcus, Federal
Communications Commission, “Regulatory Issues Related to UWB” Bob
Brodersen,
UC Berkeley Wireless Research Center, “Practical Issues of UWB
Implementation and Co-existence” Vahid
Tarokh, Harvard
University, “UWB Interference Issues and Mitigations” John
McCorkle,
XtremeSpectrum, “Impact on the Implementation of UWB Radios Considering
UWB Propagation Effects and Minimization of Its Potential for
Interference” Sponsors:
MTT-16 and MTT-20
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PTHA: RF MEMS business ventures and issues Date & Time: Thursday, June
12, 12:00 PM to 1:00 PM Location: Ballroom Organizers: Dr. J.C. Chiao, University of
Texas – Arlington
Mr. Krishna Srinivasan,
Austin Ventures While RF MEMS technologies have already enabled many wireless
applications and enhanced the performance of existing device architectures
in applications with frequencies from VHF through infrared, some market
analysts predicted a steady high-growth of MEMS technologies in the
wireless sector in the next five years. Driven by innovation, would RF
MEMS be reliable, cost-effective and RFIC-compatible enough to be
supported by wireless market demands? What would be the challenges in the
RF MEMS commercialization roadmap on both technical and business
issues? Speakers: Dr. Charles Goldsmith,
MEMtronics
Mr. Jeff Hilbert,
Coventor
Dr. Daniel Hyman, XCom
Wireless
Mr. Didier Lacroix,
Discera
Dr. Dr. Robert Miracky,
Teravicta Technologies
Dr. Mary Ann Maher,
MEMSCAP Dr. Jun Shen, Microlab
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