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EVG developed the world's first optical, double-sided alignment system that incorporated high-precision backside optical alignment. This high precision, backside alignment technology was key to several application segments, including the Micro System Technology and MEMS market segments, to achieve their leading-edge technology development. Today, EVG provides the most advanced alignment systems around. The EVG620 Series are designed to offer the highest precision, flexibility, ease-of-use, and modular upgrade capability. The EVG620 Systems accommodate wafers and substrates up to 150 mm, varying in size, shape, and thickness.


  • High resolution top and bottom side splitfield microscopes
  • Handling of multiple wafer sizes with quick change-over time
  • High degree of automation (multiple send/receive cassettes)
  • Manual substrate loading capability on automated system
  • Windows® based user interface