The Micro Automation Saw Model 1100 Wafer Dicing Saw is a Microprocessor-controlled, programmable, automatic saw for cutting semiconductor wafers and other hard material. The saw uses a closed circuit TV system with split image optics to align the wafers before cutting, program and data display, and monitoring. A high torque air bearing motor with a controllable speed turns the cutting wheel, which accepts any two-inch nominal saw blade. A vacuum holds the wafer on the chuck while cutting. The chuck moves right, left, up, and down, and rotates under operator or program control. All operations are computer controlled by the user.
Programmable dicing saw
For dicing silicon, and glass wafers
Maximum wafer size: 6” diameter