the Model 7476E-79 is an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semi-conductor, hybrid or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations.
This machine has a single wedge bond tool head with angled clamp Assy and overhead clamp for bonding by either wedge method with adjustable height work platform.
Wedge Wire Bonder, X-Y-Z, Convertible, Adjustable Height platform
LED Luxuray Illuminator, single array, with stand-alone power supply
Temperarture controller, 400 Watts
Free Furnace Workholder
External View TV Camera
Microscope with 20X Eye Pieces