The UTARI Packaging and Inspection Laboratory has a wide range of high-tech equipment that supports the Product Engineering Division. The equipment is used in our research related to silicon microfabrication, micro-electro-mechanical systems devices, sensors, and electronics. Some of our equipment capabilities include:
- wire and flip chip bonding,
- scanning electron microscope (SEM),
- electrical and mechanical reliability testing,
- as well as optical inspection and measurement.