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Packaging and Inspection Laboratory

The UTARI Packaging and Inspection Laboratory has a wide range of high-tech equipment that supports the Advanced Manufacturing Division. The equipment is used in our research related to silicon microfabrication, micro-electro-mechanical systems devices, sensors, and electronics. Some of our equipment capabilities include:

  • wire and flip chip bonding,
  • micro-assembly,
  • electrical and mechanical reliability testing,
  • as well as optical inspection and measurement.