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Product Engineering

Publications and Conference Papers

Publications

2012

A. N. Das, H. E. Stephanou, R. Murthy, “Because things are getting smaller – Cross-scale integration of assembly”, MICROmanufacturing magazine, January/February Issue 2012.

Mayyas, M. Comprehensive Thermal Modeling of ElectroThermoElastic Microstructures. Actuators 2012, 1, pp. 21-35.

2011

A. N. Das, R. Murthy, D. O. Popa, H. E. Stephanou, “A Multiscale Assembly & Packaging System for Manufacturing of Complex Micro-nano Devices”, IEEE Transactions on Automation Science and Engineering (T-ASE), Vol. 9, Issue. 1, page(s): 160-170, Jan 2011.

S. Son, S. Lee, Y.J. Kim, J. Choi, J. Sin, W.H. Lee, M. Wijesundara, and H. Stephanou, “Array-Nozzle EHD Print Head and its Drop-on-Demand Experimentation,” Nanotech Con. & Expo, Boston, MA, June, 2011.

2010

A. N. Das, H. E. Stephanou, “Design for Micromanufacturability”, LASTWord in MICROmanufacturing magazine, November/December Issue, 2010.

J. Sin, W.H. Lee, and H. Stephanou, “Sensitivity Analysis of an Assembled Fourier Transform Microspectrometer,” Proc. SPIE, Vo. 7680, Orlando, FL, 2010.

Saket Karajgikar, Smitha Rao, Jeongsik Sin, Dereje Agonafer, Jung-Chih Chiao, Dan Popa, and Harry Stephanou, “Electro-Thermal Analysis of In-Plane Micropump,” IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 2, June 2010, pp. 329-339.

2009

A. N. Das, J. Sin, D. O. Popa, and H. E. Stephanou, “Precision Alignment and Assembly for a Fourier Transform Microspectrometer”, International Journal of Micro-Nano Mechatronics (JMNM), Vol. 5, No. 1-2, Springer Berlin, page(s): 15-28, 2009.

D. O. Popa, R. Murthy, A. N. Das, “M³ - Deterministic, Multiscale, Multirobot Platform for Microsystems Packaging: Design and Quasi-Static Precision Evaluation”, IEEE Transactions on Automation Science and Engineering (T-ASE), Vol. 6, Issue: 2, page(s): 345–361, 2009.

H. Kim, W.H. Lee, H.V. Dias, and S. Priya, “Piezoelectric Microgenerators – Current Status and Challenges,” IEEE Trans. on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 56, no. 8, August, pp.1555-1568, 2009.

Mayyas, M., Zhang, P., Lee, W-H., Popa, D., Chiao, JC. “An active micro joining mechanism for 3-D assembly.” J. Micromech. Microeng., Volume 19, 2009.

Mayyas, M., Sin, J., Stephanou, H. “Methodologies for the Assembly of a Fiber Coupled MEMS Fourier Transform Spectrometer.” IEEE Transactions on Components and Packaging Technologies. Vol. 32,issue 1, 2009, pp. 658-666.

Mayyas, M., Shiakolas, P. “Micro-surfaces reverse engineering and compensation for laser micromachining.” IEEE Transactions on Automation Science and Engineering. Volume 6, issue 2, 2009, pp. 291-301.

Sin J., Lee W.H., Mittal M., Mayyas. M, and Harry Stephanou, Manufacturability Analysis of Assembled FT Microspectrometer,” International Conference on Optical MEMS & Nanophotonics (Clearwater, Florida, 2009).

2007

Hsu, T. Ativanichayaphong, H. Cao, J. Sin, M. Graff, J.C. Chiao, and H.E. Stephanou, “Evaluation of commercial metal oxide based NO2 sensors,” Sensor Review, Vol.27, No. 2, pp.121-131, 2007.

2006

Mayyas, M., Shiakolas, P., 2006. A Study on The Thermal Behavior Of Electrothermal Microactuators Due To Various Voltage Inputs. Proceedings of IMECE 2006, Paper No. IMECE2006-15321 (Chicago IL, November 2006).

Mayyas, M., Shiakolas, P. , Lee, W. H., Popa, D., Stephanou, H.; 2006. Static and dynamic modeling of thermal microgripper. MED06-14th Mediterranean Conference in Automation and Control (Ancona, Italy, June 2006).

Mayyas, M., Zhang, P., Shiakolas, P., Lee W. H., Popa, D., Stephanou,H., 2006. Issues in the Current and Thermal Distribution for a Probed Electrothermal MEMS Actuator of Parallel Resistive Structure. TEXMEMS VIII International Conference on MEMS (Dallas, Texas, Sept-2006).

V. Sharma, M. R. Hossu, W.H. Lee, A.R. Koymen, and S. Priya, “Enhanced piezoresistive characteristics of Nb2O5 modified La0.8Sr0.2MnO3 ceramics,” Applied Physics Letters, 89, 202902, 2006.

Zhang, P., Mayyas, M., Lee W. H., Popa, D., Shiakolas P., Stephanou, H., Chiao, JC., 2006. Design of an Active Lock for Integrating 3D Micro Structures. TEXMEMS VIII International Conference on MEMS (Dallas, Texas, Sept-2006).

2005

Mayyas, M., Shiakolas, P., 2005. Application of Thin Plate Splines for Surface Reverse Engineering and Compensation for Femtosecond Laser Micromachining. Proceedings of the IEEE International Symposium on Intelligent Control: Mediterranean Conference on Control and Automation (Cyprus, 2005).

Mayyas, M., Lee, W. H., Popa, D., Shiakolas, P., Zhang, P., Stephanou, H., 2005. Comprehensive Electrothermal Modeling of a Thermal Microgripper. TEXMEMS VII International Conference on MEMS (El Paso, Texas, September 2005).

Hsu, L.,George,V.,Popa, D., Lee, W. H., Mayyas, M., Zhang, P., Stephanou, H., Chiao, JC., 2005. 3D Microassembly Station. in Proceedings of TexMEMS VII (El Paso, Texas, September 2005).

Mayyas, M., Shiakolas, P., 2005. Transient Thermal Model of an Attached Lateral Thermal Actuator. TEXMEMS VII International Conference on MEMS, (El Paso, Texas, September 2005).

Conference Papers

2013

A. N. Das, “Quantitative Optimization of a Custom Flexible Manufacturing Platform for Assembly and Packaging of Heterogeneous Microsystems”, Proceedings of ASME 2013 International Mechanical Engineering Congress & Exposition (ASME-IMECE), San Diego, CA, November 2013. 

A. N. Das, S. Savoie, “A Low Cost, Modular and Reconfigurable Manufacturing Cell for Construction of Heterogeneous Micro-Nano Systems”, Proceedings of Tech Connect World Summit, Washington DC, USA, May 2013.

A. N. Das, S. Savoie, “Quasi-static Evaluation of a Modular and Reconfigurable Manufacturing Cell”, Proceedings of IEEE International Conference on Robotics and Automation (ICRA), Karlsruhe, Germany, May 2013.

2012

R. Sidhu, J. Sin, W.H. Lee, H. Stephanou, and M. Wijesundara, “Electrohydrodynamic Printing of Metal Oxide Microstructures,” Proc. 7th International Conference on MicroManufacturing, pp. 458-461, Chicago, IL, March, 2012.

2011

A. N. Das, R. Murthy, “Integrated Heterogeneous Micro-nano Systems via Modular Designing and Flexible Assembly”, ASME 2011 International Mechanical Engineering Congress & Exposition (IMECE), Vol. 11, Denver, CO, USA, page(s): 849-854, November 2011.

A. N. Das, H. E. Stephanou, “Concurrent Engineering in A Microfactory”, Commercialization of Micro-Nano Systems Conference (COMS), Greensboro, North Carolina, USA, August, 2011.

A. N. Das, H. E. Stephanou, “Design of Microassembly through Process Modeling in Virtual Reality”, Microtech conference and expo, Boston, MA, USA, June, 2011.

Son S., Lee S. , Kim Y-J., An K., Choi J, Sin J., Lee W.H., Wijesundara M.B.J., Stephanou H.E., Array-Nozzle EHD Print Head and its Drop-on-Demand Experimentation, Proceedings of Nanotech 2011, June 13-16, 2011, Boston, MA.

2010

R. Murthy, A. N. Das, H. E. Stephanou, “Micro-Nano Integration via Hybrid Control of Multiscale Manipulators”, Proceedings of IEEE Nanotechnology Materials and Devices Conference (NMDC), Monterey, California, USA, page(s): 61-64, October, 2010.

A. N. Das, R. Murthy, H.E. Stephanou, “Design for Micromanufacturability”, Commercialization of Micro-Nano Systems Conference (COMS), Albuquerque, New Mexico, USA, August-September, 2010.

R. Murthy, A. N. Das, H. E. Stephanou, “Micro-Nano Integration via Hybrid Control of Multiscale Manipulators”, Proceedings of IEEE Nanotechnology Materials and Devices Conference (NMDC), Monterey, California, USA, page(s): 61-64, October, 2010.

J. Sin, W.H. Lee, and H. Stephanou, “Sensitivity Analysis of an Assembled Fourier Transform Microspectrometer,” Proc. SPIE, Vo. 7680, Orlando, FL, 2010.

2009

K. Rabenorosoa, C. Clevy, and P. Lutz, A. N. Das, R. Murthy, D. O. Popa, “Precise motion control of a piezoelectric microgripper for microspectrometer assembly”, Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE), San Diego, USA, page(s): 769-776, September, 2009.

Sin J., Lee W.H., Mittal M., Mayyas. M, and Harry Stephanou, Manufacturability Analysis of Assembled FT Microspectrometer,” International Conference on Optical MEMS & Nanophotonics (Clearwater, Florida, 2009).

G. Zimbru, W. Lee, and D. Popa, “Design and Fabrication of Microflap Actuators for Steering of Micro Air Vehicles,” Proc. SPIE Int. Soc. Opt. Eng., 7318, 2009.

2008

A. N. Das, J. Sin, D. O. Popa, and H. E. Stephanou, “On the Precision Alignment and Hybrid Assembly Aspects in Manufacturing of a Microspectrometer”, Proceedings of IEEE Conference on Automation Science and Engineering (CASE), Washington DC, USA, page(s): 959-966, August 2008.

A. N. Das, J. Sin, D. O. Popa, and H. E. Stephanou, “Design and Manufacturing of a Fourier Transform Microspectrometer”, Proceedings of the 8th IEEE International Conference on Nanotechnology (IEEE-NANO), Arlington, Texas, USA, page(s): 837-840, August 2008.

R. Murthy, A. N. Das, D. O. Popa, “High Yield Assembly of Compliant MEMS Snap Fasteners”, Proceedings of the ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE), Brooklyn, New York, USA, page(s): 789-797, August 2008.

2007

A. N. Das, P. Zhang, W. H. Lee, D. O. Popa, and H. E. Stephanou, “µ³: Multiscale, Deterministic Micro-Nano Assembly System for Construction of On-Wafer Microrobots”, Proceedings of IEEE International Conference on Robotics and Automation (ICRA), Rome, Italy, page(s): 461-466, April 2007.

D. O. Popa, W. H. Lee, R. Murthy, A. N. Das, H. E. Stephanou, “High Yield Automated MEMS Assembly”, Proceedings of IEEE Conference on Automation Science and Engineering (CASE), Arizona, USA, page(s): 1099-1104, September 2007.

A. N. Das, P. Zhang, W. H. Lee, D. O. Popa, and H. E. Stephanou, “µ³: Multiscale, Deterministic Micro-Nano Assembly System for Construction of On-Wafer Microrobots”, Proceedings of IEEE International Conference on Robotics and Automation (ICRA), Rome, Italy, page(s): 461-466, April 2007.

N. Lakhkar, A. Fasoro, W.H. Lee, D. Popa, D. Agonafer, and H. Stephanou, “Process Development and Die Shear Testing in MOEMS Packaging,” ASME InterPACK’07, British Columbia, Canada, July 2007.

R. Murthy, A. N. Das, D. O. Popa, H. E. Stephanou, “M³: Multiscale, Deterministic and Reconfigurable Macro-Micro Assembly System for Packaging of MEMS”, Proceedings of IEEE International Conference on Robotics and Automation (ICRA), Rome, Italy, page(s): 668-673, April 2007.

2006

A. Fasoro, D. Popa, A. Patil, W. Lee, J. Sin, and H. Stephanou, “Fluxless Soldering for Hermetic Packaging of MOEMS,” IMAPS International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, March 2006.

A. Fasoro, A. Patil, D. Popa, H. Beardsley, D. Agonafer and H. Stephanou, “Fluxless soldering of MOEMS,” ITHERM Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, May, 2006.

A. Fasoro, P. Pandojirao-S, W.H. Lee, D. O. Popa, H. Stephanou, and D. Agonafer, “Die and Wafer-Level Hermetic Sealing Using SnAn Solder for MEMS Applications,” TexMEMS VIII Workshop, Dallas, TX, 2006.

A. Kole, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H. Stephanou, “Design of Polymer Tube Embedded In-Plane Micropump,” ITHERM, San Diego, 2006.

Mayyas, M., Shiakolas, P., 2006. A Study on The Thermal Behavior Of Electrothermal Microactuators Due To Various Voltage Inputs. Proceedings of IMECE 2006, Paper No. IMECE2006-15321 (Chicago IL, November 2006).

Mayyas, M., Shiakolas, P., 2006. Micro-Surface Construction and Characterization from Digital Elevation Model Using Thin Plate Splines in Matlab Environment. Proceedings of IMECE 2006, Paper No. IMECE2006-13471, (Chicago IL, November 2006).

Mayyas, M., Zhang, P., Shiakolas, P., Lee W. H., Popa, D., Stephanou,H., 2006. Issues in the Current and Thermal Distribution for a Probed Electrothermal MEMS Actuator of Parallel Resistive Structure. TEXMEMS VIII International Conference on MEMS (Dallas, Texas, Sept-2006).

S. Mukherjee, W.H. Lee, R.A. Islam, and S. Priya, “High Energy Density Piezoelectric Materials and Applications,” 2006 U.S. Navy Workshop on Acoustic Transduction Materials and Devices, The Penn State Conference Center, Pennsylvania, May 2006.

R. Murthy, A. N. Das, M. Mittal, D. O. Popa, “M³: Multiscale Assembly and Packaging System for MOEMS”, Proceedings of Surface Mount Technology Association International Conference (SMTAI), Chicago, Illinois, September 2006.

D. Popa, J. Sin, R. Murthy, M. Mittal, and H. Stephanou., "Modular Microassembly System for MEMS Packaging", ANS Conference Sharing Solutions for Emergencies and Hazardous Environments, Salt Lake City, Utah, February 2006.

D. Popa, W.H. Lee, J. Sin, A.N. Das, R. Murthy, and P. Zhang, “M3 and 3: Multiscale, Deterministic Micro-Nano Assembly Systems for Construction of On-Wafer Microrobots,” TexMEMS VIII Workshop, Dallas, TX, 2006.

J. Sin, W.H. Lee, D. Popa, and H.E. Stephanou, “Assembled Fourier Transform Micro-spectrometer,” SPIE MOEMS-MEMS, San Jose, January 2006.

W.H. Lee, D. Popa, J. Sin, V. George, and H.E. Stephanou, “Compliant Microassembly of MEMS,” Sharing Solutions for Emergencies and Hazardous Environments, Utah, February 2006.

Zhang, P., Mayyas, M., Lee W. H., Popa, D., Shiakolas P., Stephanou, H., Chiao, JC., 2006. Design of an Active Lock for Integrating 3D Micro Structures. TEXMEMS VIII International Conference on MEMS (Dallas, Texas, Sept-2006).

Zhang, P., Mayyas, M., Lee,W. H., Popa,D., Shiakolas,, P., Stephanou, H., Chiao, JC., 2006. An Active Locking Mechanism for Assembling 3D Micro Structures. SPIE International Smart Materials, Nano- & Micro-Smart Systems Symposium (Adelaide Australia, December 10-13 2006).

2005

A. Fasoro, A. Patil, W.H. Lee, J. Sin, H. Beardsley, D. Popa, and H.E. Stephanou, “Fluxless Soldering of MOEMS,”  TexMEMS VII International Conference on Micro Electro Mechanical, El Paso, Texas, September 2005.

Hsu, L., George, V., Popa, D., Lee, W. H., Mayyas, M., Zhang, P., Stephanou, H., Chiao, JC., 2005. 3D Microassembly Station. in Proceedings of TexMEMS VII (El Paso, Texas, September 2005).

A.S. Kole, K. Bushan, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H.E. Stephanou, “Polymer tube embedded in-plane micropump: design, analysis and fabrication,” ASME Int’l Mechanical Engineering Congress & Exposition, November 2005.

A.S. Kole, J. Sin, W.H. Lee, D. Popa, D. Agonafer, and H.E. Stephanou, “Polymer tube embedded in-plane micropump,” TexMEMS VII International Conference on Micro Electro Mechanical, El Paso, Texas, September 2005.

Mayyas, M., Shiakolas, P., 2005. Application of Thin Plate Splines for Surface Reverse Engineering and Compensation for Femtosecond Laser Micromachining. Proceedings of the IEEE International Symposium on Intelligent Control: Mediterranean Conference on Control and Automation (Cyprus, 2005).

D. Popa, M. Deeds, A. Fasoro, H. Beardsly, J. Sin, W.H. Lee, and R. Fernandez, “Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives,” ASME Int’l Mechanical Engineering Congress & Exposition, November 2005.

R. Murthy, M. Mittal, D. Popa, J. Sin, and H. Stephanou, "Modular microassembly system for MEMS packaging," TEXMEMS VII International Conference on MEMS, El Paso, TX, September 2005.