Choong-un Kim, Ph.D.

Research Interests:

• Thin-film metallurgy and phase transformation
• Alloy design and diffusion mechanism
• Reliability physics and failure analysis of microelectronics devices

Funded Research Topic(s) & Sponsoring Agency(ies):

• Comprehensive Evaluation of Electromigration Failure in Electronic Packaging for Enhanced Reliability Prediction and Design (Semiconductor Research Corporation)
• Nb3SN Superconducting Cavities by Bronze Routes for Accelerator Stewardship (U.S. Department of Energy – Division of Basic Science/High Energy Physics)

Contact Information