Choong-un Kim, Ph.D.

Materials Science and Engineering Department

Research Interests:

  • Thin-film metallurgy and phase transformation
  • Alloy design and diffusion mechanism
  • Reliability physics and failure analysis of microelectronics devices

Funded Research Topic(s) & Sponsoring Agency(ies):

  • Comprehensive Evaluation of Electromigration Failure in Electronic Packaging for Enhanced Reliability Prediction and Design (Semiconductor Research Corporation)
  • Nb3SN Superconducting Cavities by Bronze Routes for Accelerator Stewardship (U.S. Department of Energy – Division of Basic Science/High Energy Physics)

Contact Information

817-272-5497
choongun@uta.edu
LinkedIn
Choong-un Kim, Ph.D., Materials Science and Engineering