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Adhesion and Fracture in Thin Films and Devices

Friday, March 31, 2017, 11:00 AM - 12:30 PM
Nedderman Hall Room 203

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Neville Reid Moody, PhD FASM FMRS Sandia National Laboratories (Retired)

Abstract

Nanostructured materials are the basis for many emerging technologies, such as MEMS, NEMS and small scale electronics, that will dominate near term advances in nanotechnology. These technologies are often based on devices containing layers of metal and ceramic films, and interconnects creating surfaces and interfaces with properties and responses that differ dramatically from bulk counterparts. The differing properties can lead to delamination and buckling in compression and film fracture and decohesion in tension, resulting in device failure. Bulk material behavior cannot be simply extrapolated to the nanoscale. Moreover, severe limitations are imposed by test methods that are difficult or impossible to apply at the smallest size scales. As a result, the relationships between composition, structure and properties, and especially adhesion and fracture, are not well defined. These relationships are critical to assuring performance and reliability of nanostructured materials and devices. For example, tantalum nitride films are used extensively in microelectronic applications. Gold films are of special interest where the need to minimize stress effects requires deposition of very thin films. And tailored oxides are often used to provide surface and wear protection. In all these systems, adhesion and fracture control performance and reliability. In this presentation we will review our use of nanomechanics and nanoindentation techniques to measure fracture properties and define processes controlling adhesion and fracture in microelectronic films and interconnects.

This work is supported by Sandia National Laboratories, a multiprogram laboratory operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation for the United States Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000.

Bio

Neville MoodyNeville Moody earned his Ph.D. degree in Materials Science from the University of Minnesota in 1981. After joining Sandia National Laboratories, his research focused on the determination of hydrogen effects on deformation and fracture in titanium, stainless steels, and superalloys, employing experimental testing, modeling, and simulation techniques. For the past 25 years his research has included the study of deformation and fracture on the submicron scale in thin films and small volumes. He has given more than 100 invited presentations and authored or co-authored more than 170 publications, including invited reviews and chapters in the encyclopedia on Comprehensive Structural Integrity and the encyclopedia of Gaseous Hydrogen Embrittlement of High Performance Metals in Energy Systems. Moody has co-organized three International Conferences on Hydrogen Effects in Materials, three International Conferences on Environmental Damage in Structural Materials, eleven TMS symposia on hydrogen effects, fracture of titanium alloys, and nanomechanical behavior of thin films and small volumes, seven MRS symposia on thin films, nanomechanical behavior, and nanostructuring of materials, two ICMCTF symposia on Coatings for Compliant Substrates, a symposium on fracture at the nanoscale for ECF16, probing properties at the nanoscale for ICN4, fracture in MEMS for ICF12, three regional materials and welding technology conferences. He co-chaired the 2005 MRS Spring Meeting in San Francisco, and was vice chair 2012 and chair of the 2014 Gordon Conferences on Thin Film and Small Volume Mechanical Behavior. He also served as the Director of Programming on the TMS Board of Directors from 2012 until 2015. He is an active member of several TMS, MRS, and ASM committees, and on the board of review for Metallurgical and Materials Transactions. Dr. Moody is a Fellow of ASM International and MRS.

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