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Dereje Agonafer, Ph.D.

Dereje Agonafer, Ph.D.Mechanical and Aerospace Engineering Department

Research Interests:

  • 3D packaging

  • Data center cooling

  • Thermoelectrics

  • Chip-scale packaging

  • Compact modeling

  • Computer-aided Electro-Thermo-Mechanical Design

  • Air cooling

  • Reliability

Contact Information

817-272-7377
agonafer@uta.edu
Google Scholar

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