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Microscale Thermophysics Lab

The Microscale Thermophysics Lab carries out research and education activities in microscale thermal transport in engineering devices and systems. 

The Microscale Thermophysics Laboratory hosts state-of-the-art equipment to facilitate research in microscale heat transfer and computing resources for analytical and numerical modeling. We have access to a further array of experimental equipment, including microfabrication tools, through our affiliation with the UT Arlington Research Institute, Shimadzu Institute Nanotechnology Research Center, Shimadzu Institute for Research Technologies, and Characterization Center for Materials and Biology .

We are also involved in outreach and dissemination activities aimed at attracting middle-school students toward STEM education and STEM-related careers. For this purpose, we have partnerships with middle schools in nearby ISDs for ongoing activities involving their students.

Current and recent research projects include:

  • Investigation of multi-physics
  • Coupled phenomena in Li-ion cells for electrochemical energy conversion
  • Heat transfer in additive manufacturing
  • Thermal transport in three-dimensional integrated circuits, and
  • Temperature measurement in exterme conditions. 

Personnel

Ankur Jain, Ph.D., Lab Director

Current Students

  • Dhananjay Mishra (Ph.D.)
  • Amirhossein Mostafavi (Ph.D.)
  • Mohammad Parhizi (Ph.D.)
  • Hardikkumar Prajapati (Ph.D.)
  • Darshan Ravoori (Ph.D.)
  • Swapnil Salvi (Ph.D.)
  • Aditya Ganesh Ram (M.S.)

Alumni

  • Leila Choobineh (Ph.D.)
  • Stephen Drake (Ph.D.) 
  • Daipayan Sarkar (Ph.D.)
  • Krishna Shah (Ph.D.)
  • Vivek Vishwakarma (Ph.D.)
  • Dean Anthony (M.S.)
  • Abhijeet Dhakane (M.S.)
  • Annas Javed (M.S.)
  • Swapnil Luhar (M.S.)
  • Dhananjay Mishra (M.S.)
  • Bhavik Patel (M.S.)
  • Abhinav Prasad (M.S.)
  • Ratnesh Raj (M.S.)
  • Salwa Shaik (M.S.)
  • Arya Banait (B.S.)
  • Divya Chalise (B.S.)
  • Iretomiwa Esho (B.S.)

Publications

Journal Publications

  • Mostafavi, A., Parhizi, M., Jain, A., 'Theoretical modeling and optimization of fin-based enhancement of heat transfer into a phase change material,' Int. J. Heat Mass Transfer, 145, pp. 118698:1-10, 2019.
  • Parhizi, M., Jain, A., 'The impact of thermal properties on performance of phase change based energy storage systems,' Applied Thermal Engineering, 162, pp. 114154:1-10, 2019.
  • Ravoori, D., Prajapati, H., Talluru, V., Adnan, A., Jain, A., 'Nozzle-integrated pre-deposition and post-deposition heating of previously deposited layers in polymer extrusion based additive manufacturing,' Additive Manufacturing, 28, pp. 719-726, 2019.
  • Parhizi, M., Jain, A., 'Theoretical modeling of a phase change heat transfer problem with a pre-melted or pre-solidified region,' Int. J. Heat Mass Transfer, 136, pp. 635-643, 2019.
  • Prajapati, H., Chalise, D., Ravoori, D., Taylor, R.M., Jain, A., 'Improvement in build-direction thermal conductivity in extrusion-based polymer additive manufacturing through thermal annealing,' Additive Manufacturing, 26, pp. 242-249, 2019.
  • Prasad, A., Parhizi, M., Jain, A., 'Experimental and numerical investigation of heat transfer in Li-ion battery pack of a hoverboard,' International Journal of Energy Research, 43, pp. 1802-1814, 2019.
  • Shah, K., Jain, A., 'Prediction of thermal runaway and thermal management requirements in cylindrical Li-ion cells in realistic scenarios,' International Journal of Energy Research, 43, pp. 1827-1838, 2019.
  • Ravoori, D., Lowery, C., Prajapati, H., Jain, A., 'Experimental and theoretical investigation of heat transfer in platform bed during polymer extrusion based additive manufacturing,' Polymer Testing, 73, pp. 439-446, 2019.
  • Parhizi, M., Jain, A., 'Analytical modeling and optimization of phase change thermal management of a Li-ion battery pack,' Appl. Therm. Eng., 148, pp. 229-237, 2019.
  • Parhizi, M., Jain, A., 'Solution of the phase change Stefan problem with time-dependent heat flux using perturbation method,' J. Heat Transfer, 141, pp. 024503:1-5, 2019.
  • Prajapati, H., Ravoori, D., Jain, A., 'Measurement and modeling of filament temperature distribution in the standoff gap between nozzle and bed in polymer-based additive manufacturing,' Additive Manufacturing, 24, pp. 224-231, 2018.
  • Esho, I.1, Shah, K.1, Jain, A., 'Measurements and modeling to determine the critical temperature for preventing thermal runaway in Li-ion cells,' Applied Thermal Engineering, 145, pp. 287-294, 2018. (1=Equal Contributors).
  • Ravoori, D., Alba, L., Prajapati, H., Jain, A., 'Investigation of process-structure-property relationships in polymer extrusion based additive manufacturing through in situ high speed imaging and thermal conductivity measurements,' Additive Manufacturing, 23, pp. 132-139, 2018.
  • Ahmed, M., Shaik, S., Jain, A., 'Measurement of radial thermal conductivity of a cylinder using a time-varying heat flux method,' Int. J. Therm. Sci., 129, pp. 301-308, 2018.
  • Prajapati, H., Ravoori, D., Woods, R.L., Jain, A., 'Measurement of anisotropic thermal conductivity and inter-layer thermal contact resistance in polymer fused deposition modeling (FDM),' Additive Manufacturing, 21, pp. 84-90, 2018.
  • Parhizi, M., Ahmed, M.B., Jain, A., 'Determination of the core temperature of a Li-ion cell during thermal runaway,' J. Power Sources, 370, pp. 27-35, 2017.
  • Chalise, D., Shah, K., Prasher, R., Jain, A., 'Conjugate heat transfer analysis of thermal management of a Li-ion battery pack,' ASME J. Electrochem. Energy Storage Conversion, 15, pp. 011008:1-8, 2018.
  • Vishwakarma, V., Jain, A., 'Enhancement of thermal transport in Gel-Polymer Electrolytes with embedded BN/Al2O3 nano- and micro-particles,' J. Power Sources, 362, pp. 219-227, 2017.
  • Chalise, D., Shah, K., Halama, T., Komsiyska, L., Jain, A., 'An experimentally validated method for temperature prediction during cyclic operation of a Li-ion cell,' Int. J. Heat Mass Transfer, 112, pp. 89-96, 2017.
  • Luhar, S., Sarkar, D., Jain, A., 'Steady state and transient analytical modelling of non-uniform convective cooling of a microprocessor chip due to jet impingement,' Int. J. Heat Mass Transfer, 110, pp. 768-777, 2017.
  • Shah, K., Balsara, N., Banerjee, S., Chintapalli, M., Cocco, A.P., Chiu, W.K.S., Lahiri, I., Martha, S., Mistry, A., Mukherjee, P., Ramadesigan, V., Sharma, C., Subramanian, V.R., Mitra, S., Jain, A., 'State-of-the-art and future research needs for multiscale analysis of Li-ion cells,' ASME J. Electrochem. Energy Storage Conversion, 14, pp. 020801:1-17, 2017.
  • Anthony, D., Wong, D., Wetz, D., Jain, A., 'Non-invasive measurement of internal temperature of a cylindrical Li-ion cell during high-rate discharge,' Int. J. Heat Mass Transfer, 111, pp. 223-231, 2017.
  • Choobineh, L., Jones, J., Jain, A., 'Experimental and numerical investigation of inter-die thermal resistance in 3D ICs,' J. Electron. Packag., 139, pp. 020908:1-6, 2017.
  • Anthony, D., Wong, D., Wetz, D., Jain, A., 'Improved thermal performance of a Li-ion cell through heat pipe insertion,' J. Electrochem. Soc., 164, pp. A971-976, 2017.
  • Anthony, D., Sarkar, D., Jain, A., 'Non-invasive, transient determination of the core temperature of a heat-generating solid body,' Scientific Reports, 6, pp. 35886:1-10, 2016.
  • Shah, K., Chalise, ,D., Jain, A., 'Experimental and theoretical analysis of a method to predict thermal runaway in Li-ion cells,' J. Power Sources, 330, pp. 167-174, 2016.
  • Shah, K.1, Vishwakarma, V.1, Jain, A., 'Measurement of multiscale thermal transport phenomena in Li-ion cells: A review,' ASME. J. Electrochem. Energy Conv. Storage., 13, pp. 030801:1-13, 2016. (1=Equal Contributors).
  • Ostanek, J., Shah, K., Jain, A., 'Measurement sensitivity analysis of transient hot source sensors,' ASME J. Therm. Sci. & Eng. Appl. , 9, pp. 011002:1-12, 2017.
  • Yao, J., Tchafa, F.E.M., Jain, A., Tjuatja, S., Huang, H., 'Far-field interrogation of microstrip patch antenna for temperature sensing without electronics,' IEEE Sensors J., 16, pp. 7053-7060, 2016.
  • Shah, K., McKee, C., Chalise, D., Jain, A., 'Experimental and numerical investigation of core cooling of Li-ion cells using heat pipes,' Energy, 113, pp. 852-860, 2016.
  • Black, B., Vishwakarma, V., Dhakal, K., Bhattarai, S., Pradhan, P., Jain, A., Kim, Y-T., Mohanty, S., 'Spatial temperature gradients guide axonal outgrowth,' Scientific Reports , 6, pp. 29786:1-12, 2016.
  • Anthony, D., Sarkar, D., Jain, A., 'Contactless, non-intrusive core temperature measurement of a solid body in steady-state,' Int. J. Heat Mass Transfer, 101, pp. 779-788, 2016.
  • Sarkar, D., Jain, A., Goldstein, R., Srinivasan, V., 'Corrections for lateral conduction error in steady-state heat transfer measurements,' Int. J. Therm. Sci., 109, pp. 413-423, 2016.
  • Sarkar, D., Haji-Sheikh, A., Jain, A., 'Thermal conduction in an orthotropic sphere with circumferentially varying convection heat transfer,' Int. J. Heat Mass Transfer, 96, pp. 406-412, 2016.
  • Vishwakarma, V., Waghela, C., Wei, Z., Prasher, R., Nagpure, S.C., Li, J., Liu, F., Daniel, C., Jain, A., 'Heat transfer enhancement in a Lithium-ion cell through improved material-level thermal transport,' J. Power Sources , 300, pp. 123-131, 2015.
  • Shah, K., Jain, A., 'An iterative, analytical method for solving conjugate heat transfer problems,' Int. J. Heat Mass Transfer, 90, pp. 1232-1240, 2015.
  • Sarkar, D., Haji-Sheikh, A., Jain, A., 'Temperature distribution in multi-layer skin tissue in presence of a tumor,' Int. J. Heat Mass Transfer, 91, pp. 602-610, 2015.
  • Vishwakarma, V., Waghela, C., Jain, A., 'Measurement of out-of-plane thermal conductivity of substrates for flexible electronics and displays,' Microelectronic. Eng., 142, pp. 36-39, 2015.
  • Drake, S., Martin, M., Wetz, D.A., Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., 'Heat generation rate measurement in a Li-ion cell at large C-rates through temperature and heat flux measurements,' J. Power Sources 285, pp. 266-273, 2015.
  • Shah, K., Jain, A., 'Modeling of steady-state and transient thermal performance of a Li-ion cell with an axial fluidic channel for cooling,' Int. J. Energy Res. , 39, pp. 573-584, 2015.
  • Choobineh, L., Jain, A., 'An explicit analytical model for rapid computation of temperature field in a three-dimensional integrated circuit (3D IC),' Int. J. Therm. Sci., 87, pp. 103-109, 2015.
  • Gu, L., Black, B., Ordonez, S., Mondal, A., Jain, A., Mohanty, S., 'Microfluidic control of axonal guidance,' Scientific Reports, 4, pp. 6457:1-6, 2014.
  • Vishwakarma, V., Jain, A., 'Measurement of in-plane thermal conductivity and heat capacity of separator in Li-ion cells using a transient DC heating method', J. Power Sources, 272, pp. 378-385, 2014.
  • Sarkar, D., Shah, K., Haji-Sheikh, A., Jain, A., 'Analytical modeling of temperature distribution in an anisotropic cylinder with circumferentially-varying convective heat transfer', Int. J. Heat Mass Transfer, 79, pp. 1027-1033, 2014.
  • Shah, K., Drake, S.J., Wetz, D.A., Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., 'An experimentally validated transient thermal model for cylindrical Li-ion cells', J. Power Sources, 271, pp. 262-268, 2014.
  • Shah, K., Drake, S.J., Wetz, D.A., Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., 'Modeling of steady-state convective cooling of cylindrical Li-ion cells', J. Power Sources, 258, pp. 374-381, 2014.
  • Drake, S.J., Wetz, D.A., Ostanek, J.K., Miller, S.P., Heinzel, J.M., Jain, A., 'Measurement of anisotropic thermophysical properties of cylindrical Li-ion cells,' J. Power Sources, 252, pp. 298-304,2014.
  • Huang, Z., Jones, R.E., Jain, A., 'Experimental investigation of electromigration failure in Cu-Sn-Cu micropads in 3D integrated circuits,' Microelec. Eng., 122, pp. 46-51, 2014.
  • Mirza, F., Naware, G., Jain, A., Agonafer, D., 'Effect of through-silicon-via Joule heating on device performance for low-powered mobiles applications', Trans. ASME J. Electron. Packag., 136, pp. 041009, 2014.
  • Lingam, D., Parikh, A.R., Huang, J., Jain, A., Minary-Jolandan, M., 'Nano/microscale pyroelectric energy harvesting: Challenges and opportunities,' Int. J. Smart Nano. Mater., 4, pp. 1-17, 2013.
  • Banait, A., Vishwakarma, V., Choobineh, L., Jain, A., 'Thermally-assisted spatially-directed pore formation in Polydimethylsiloxane (PDMS)', Applied Physics Letters, 103, pp. 153702:1-5, 2013.
  • Patel, B., Jain, A., 'Thermal Modeling and Design of Ultra-Violet Nanoimprint Lithography', ASME Journal of Manufacturing Science and Engineering, in press, Special Issue on Thermally Assisted Manufacturing, 135(6), pp. 064501:1-5, 2013.
  • Choobineh, L., Jain, A., 'Determination of Temperature Distribution in Three-Dimensional Integrated Circuits (3D ICs) with Unequally-Sized Die', Applied Thermal Engineering, 56(1), pp. 176-184, 2013.
  • Choobineh, L., Jain, A. 'Analytical solution for steady-state and transient temperature field in vertically integrated three-dimensional integrated circuits (3D ICs)', IEEE Trans Components & Packaging Technologies, 2(12), pp. 2031-2039, 2012.
  • Javed, A., Iqbal, S., Jain, A., 'Microheater platform for selective detachment of DNA', Appl. Phys. Lett., 101, 093707, 2012.
  • Jain, A., Alam, S.M., Pozder, S., Jones, R.E., 'Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints', IET Computers & Digital Techniques, 5(3), pp. 169-178, 2011.
  • Jain, A., Goodson, K.E., 'Thermal microdevices for biological and biomedical applications', J. Thermal Biol., 36(4), 2011, pp. 209-218.
  • Jain, A., Jones, R.E., Chatterjee, R., Pozder, S., Huang, Z., 'Analytical and numerical modeling of the thermal performance of three-dimensional integrated circuits', IEEE Trans. Components & Packaging Technologies, 33(1), pp. 56-63, 2010.
  • Savidis, I., Alam, S.M., Jain, A., Pozder, S., Jones, R.E., Chatterjee, R., 'Electrical modeling and characterization of through-silicon vias (TSVs) for 3D integrated circuits', Microelectronics J., 41(2), pp. 9-16, 2010.
  • Alam, S.M., Jones, R.E., Pozder, S., Chatterjee, R., Jain, A., 'Interstratum connection design considerations for cost-effective 3-D system integration', IEEE Trans VLSI Systems, 18(3), pp. 450-460, 2010.
  • Jain, A., Ness, K., Goodson, K.E., 'Theoretical and experimental investigation of spatial temperature gradient effects on cells', Sensors & Actuators B: Chemical, 143, pp. 286-294, 2009.
  • Kodama, T., Jain, A., Goodson, K.E., 'Heat conduction through a DNA-Gold composite', Nano Lett., 9, pp. 2005-2009, 2009.
  • Jain, A., Goodson, K.E., 'Measurement of thermal conductivity and heat capacity of free-standing thin films using the 3-omega method', ASME J. Heat Transfer, 130(10), pp. 1-7, 2008.
  • Hu, X., Jain, A., Goodson, K.E., 'Investigation of the natural convection boundary condition in microfabricated structures', Intl. J. Thermal Sciences, 47, pp. 820-824, 2008.
  • Oh, D.-W., Jain, A., Eaton, J.K., Goodson, K.E., Lee, J.S., 'Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3-omega method', Intl J Heat and Fluid Flow, 29 (5), pp. 1456-1461, 2008.

Peer-Reviewed Conference Publications

  • Vishwakarma, V., Jain, A. 'Measurement of thermal conductivity of a flexible substrate', Proc. ASME IMECE, Montreal, QB, Nov. 2014.
  • Parhizi, M., Merrikh, A.A., Jain, A. 'Investigation of two-phase, vapor chamber based thermal management of multiple microserver chips', Proc. ASME IMECE, Montreal, QB, Nov. 2014.
  • Choobineh, L., Vo, N., Uehling, T., Jain, A., 'Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)', Proc. ASME/IEEE InterPACK, San Francisco, CA, July, 2013.
  • Choobineh, L., Agonafer, D., Jain, A., 'Analytical modeling of temperature distribution in interposer-based microelectronic systems', Proc. ASME/IEEE InterPACK, San Francisco, CA, July 2013.
  • Mirza, F., Naware, G., Raman, T., Jain, A., Agonafer, D., 'Effect of TSV Joule Heating on Device Performance', Proc. ASME/IEEE InterPACK, San Francisco, CA, July, 2013.
  • Banait, A., Vishwakarma, V., Choobineh, L., Jain, A., 'Growth of patterned micropores in polydimethylsiloxane (PDMS) using the thermocapillary effect', Proc. ASME IMECE, San Diego, CA, Nov, 2013.
  • Sarkar, D., Haji-Sheikh, A., Jain, A., 'Analytical temperature distribution in a multi-layer tissue structure in the presence of a tumor', Proc. ASME IMECE, San Diego, CA, Nov, 2013.
  • Vishwakarma, V., Singhal, N., Khullar, V., Tyagi, H., Taylor, R.A., Otanicar, T.P., Jain, A., 'Space cooling based on the concept of nanofluids-based direct absorption solar collectors rogress of 3D integration technologies and 3D interconnects', ASME IMECE, Houston, TX, Nov 2012.
  • Pozder, S., Jain, A., Jones, R.E., Huang, Z., Chatterjee, R., 'Reliability considerations in 3D stacked strata systems', Invited Paper at 10th International Workshop on Stress-Induced Phenomena in Metallization, University of Texas, Austin, TX, Nov 5-7, 2008.
  • Savidis, I., Alam, S.M., Jain, A., Pozder, S., Jones, R.E., Chatterjee, R., 'Electrical modeling & characterization of through-silicon vias (TSVs) for 3D integrated circuits', Invited Paper at Vertical Multi-level Interconnect Conference (VMIC), Fremont, CA, Oct 27-30, 2008.
  • Pozder, S., Chatterjee, R., Jain, A., Huang, Z., Jones, R.E., Acosta, E., 'Progress of 3D integration technologies and 3D interconnects', Invited Paper at IEEE International Interconnect Technology Conference (IITC), San Francisco, CA, June 2007.
  • Jain, A., Goodson, K.E., 'Thermal phenomena in biological microdevices', Invited Paper at ASME-ISHMT Heat & Mass Transfer Conference, Indian Institute of Technology (IIT), Guwahati, India, Jan 2006.
  • Jain, A., 'Thermal characteristics of multi-die, three-dimensional integrated circuits with unequally sized die', IEEE ITherm, Las Vegas, 2010.
  • Jain, A., Alam, S., Pozder, S., Jones, R.E., 'Thermal-electrical co-optimization of block-level floorplanning in 3D integrated circuits', IEEE/ASME Interpack, San Francisco, 2009.
  • Alam, S., Jones, R.E., Pozder, S., Jain, A., 'Die/Wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology', IEEE ISQED, San Jose, CA, 2009.
  • Jain, A., Jones, R.E., Chatterjee, R., Pozder, S., Huang, Z., 'Thermal modeling and design of 3D integrated circuits', IEEE ITherm, Lake Buena Vista, FL, 2008.
  • Pozder, S., Jain, A., Chatterjee, R., Huang, Z., Jones, R.E., Hillmann, G., Sobczak, M., Kriendl, G., Kanagavel, S., Kostner, H., Pargfrieder, S., '3D die on wafer Cu/Sn microconnects formed simultaneously with an adhesive dielectric bond using thermal compression bonding', IEEE IITC, San Francisco, CA, 2008.
  • Huang, Z., Chatterjee, R., Justison, P., Gajewski, D., Hernandez, R., Pozder, S., Jain, A., Acosta, E., Jones, R.E., 'Electromigration of Cu-Sn-Cu micropads in 3D interconnect', IEEE ECTC, Lake Buena Vista, FL, 2008.
  • Pozder, S., Jain, A., Chatterjee, R., Huang, Z., Jones, R.E., Sobczak, M., Kanagavel, S., Wilson, M., Hillmann, G., Kostner, H., Kreindl, G., Pargfreider, S., 'Evaluation of Adhesive Fill of Thermally Compression Bonded Die on Wafer Parts Having an Inter Die Gap of 10 µm', IEEE ECTC, Lake Buena Vista, FL, 2008.
  • Kodama, T., Jain, A., Goodson, K.E., 'Nonmetallic conduction property of a DNA templated Gold Nanowire', ASME InterPACK, Vancouver, Canada, July 2007.
  • Oh, D., Jain, A., Eaton, J.K., Goodson, K.E., Lee, J.S., 'Thermal Conductivity Measurement of Aluminum Oxide Nanofluids using the 3-Omega Method', ASME-IMECE, Chicago, Nov 2006.
  • Jain, A., Ramanathan, S., 'Theoretical investigation of sub-ambient on-chip microprocessor cooling', IEEE ITherm, San Diego, 2006.
  • Jain, A., Hu, X., Goodson, K.E., 'A new formulation for thermal transport property measurement of a two-dimensional thin film using the 3-Omega method', ASME-ISHMT Heat & Mass Transfer Conference, Guwahati, India, Jan 2006.
  • Jain, A., Goodson, K.E., 'Measurement of Thermophysical Properties of Thin Film Shape Memory Alloys using the 3-Omega Method', ASME-IMECE, Orlando, FL, Nov 2005.
  • Jain, A., Goodson, K.E., 'A Theoretical Model for Temperature Gradient Effects on Cells', ASME National Heat Transfer Conference, San Francisco, 2005.
  • Hu, X., Jain, A., Goodson, K.E., 'Investigation of the Natural Convection Boundary Condition in Microfabricated Structures', ASME National Heat Transfer Conference, San Francisco, 2005.
  • Jain, A., Ness, K., Fishman, H.A., Goodson, K.E., 'Investigation of Temperature Gradient Effects on Neurite Outgrowth in Nerve Cells using a Microfabricated Heater Structure', 3rd International IEEE-EMBS Conference on Microtechnologies in Medicine and Biology, Oahu, HI, 2005.
  • Jain, A., Upadhyay, R.R., Chandra, S., Saini, M., Kale, S., 'Experimental investigation of the flow field of a ceiling fan', ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, NC, 2004.
  • Jain, A., Ness, K., Mehenti, N., Fishman, H., Goodson, K.E., 'A Microheater Device for Study of Temperature Gradient Effects on Neurite Outgrowth in Retinal Ganglion Cells', ARVO Annual Meeting, Ft. Lauderdale, FL, 2004.
  • Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K.E., 'Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth', ASME-IMECE, Washington DC, 2003.
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