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Soft and Conformable Large-Area E-Skin

Tuesday, April 2, 2019, 3:30 AM
112 Nedderman Hall

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IEEE Seminar

Ravinder Dahiya, Ph.D.
Professor of Electronics and Nanoengineering and Engineering and Physical Sciences Research Council (EPSRC) Fellow
Bendable Electronics and Sensing Technologies Group
School of Engineering, University of Glasgow

Abstract: The miniaturization led advances in microelectronics over 50 years have revolutionized our lives through fast computing and communication. Recent advances in the field are propelled by applications such as robotics, wearable systems, and healthcare etc. through More than Moore technologies. Often these applications require electronics to conform to 3D surfaces and this calls for new methods to realize devices and circuits on unconventional substrates such as plastics and paper. This lecture will present various approaches (over different time and dimension scales) for obtaining distributed electronics and sensing components on flexible and conformable substrates, especially in context with tactile or electronic skin (e-skin). These approaches range from distributed off-the-shelf electronics, integrated on flexible printed circuit boards to advanced alternatives such as e-skin by printed nanowires, graphene and ultra-thin chips, etc. The technology for such sensitive flexible (and possibly stretchable) electronic systems is also the key enabler for numerous emerging fields such as internet of things, smart cities and mobile health etc. This lecture will also discuss how the flexible electronics research may unfold in the future.

Bio: Ravinder Dahiya is Professor of Electronics and Nanoengineering and Engineering and Physical Sciences Research Council (EPSRC) Fellow in the School of Engineering at University of Glasgow. He is the Director of Electronic Systems Design Centre and the leader of Bendable Electronics and Sensing Technologies group. His group conducts research on high-mobility materials based flexible electronics and electronic skin, and their application in robotics, prosthetics and wearable systems. Dahiya has published more than 250 research articles and 4 books, and has 12 issued and pending patents. He has given more than 110 invited talks. He has led many international projects (more than £20M) funded by European Commission, EPSRC, The Royal Society, Royal Academy of Engineering, and Scottish Funding Council. He is on the Editorial Boards of Scientific Reports, and IEEE Sensors J. He is the editor of Cambridge Elements on Flexible and Large Area Electronics. He was the Technical Program Co-Chair for IEEE Sensors Conf. in 2017 and 2018. He is the General Chair of 2019 IEEE Int. Conf. on Flexible and Printable Sensors and Systems and IEEE ICECS 2019. He is a recipient of Marie Curie and Japanese Monbusho Fellowships and several awards, most recently: 2018 Elektra award for best university research in the UK, 2016 IEEE Sensor Council Technical Achievement Award, the 2016 Microelectronic Engineering Young Investigator Award (Elsevier) and 2016 Scottish 40UNDER40.

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